Moisture-Blocking Insulation Layer for Power Electronic Switching Devices

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Solution Overview

Problem

Existing power electronic switching devices lack effective moisture protection without compromising their overall functionality.

Innovation Solution

A method for producing a power electronic switching device involving a substrate with insulated conductor tracks, a film-based connection device, and a thin, temperature-resistant, and moisture-blocking insulation layer that covers the connection device and substrate, using materials like polyphenylene sulfide or liquid crystal polymer to prevent moisture ingress.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional switching device structure is used, then the device can be manufactured with standard processes, but the device lacks effective moisture protection

Engineering Contradiction:

Improvemoisture protectionVSAvoiddevice structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies a thin film composite structure consisting of multiple layers including a moisture barrier layer, adhesive layers, and protective layers. This flexible multi-layer film system provides effective moisture protection while maintaining a relatively simple overall device structure and enabling standard manufacturing processes

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The patent uses a composite material structure with multiple functional layers: a moisture barrier layer (e.g., Parylene, polyimide), adhesive layers (e.g., epoxy resin), and protective layers. This composite approach combines the advantages of different materials to achieve both moisture protection and structural integrity without significantly increasing device complexity

Inventive Principle:

Principle #40Composite materials

2Reliability

If moisture protection is added to the switching device, then reliability against moisture ingress is improved, but the manufacturing process becomes more complex

Engineering Contradiction:

Improveprotection against moisture ingressVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The moisture barrier film is applied early in the manufacturing process, before final assembly and packaging. This preliminary application of the protective layer simplifies subsequent manufacturing steps and ensures moisture protection is built into the device structure from the beginning, rather than requiring additional complex post-processing

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The thin film composite structure serves multiple functions simultaneously: moisture barrier, electrical insulation, mechanical protection, and thermal management. This multi-functionality reduces the need for separate components and simplifies the overall manufacturing process while maintaining effective moisture protection

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method provides flexible and effective protection against moisture, ensuring the device's reliability and performance across various temperatures and pressures, while maintaining electrical integrity.

Implementation Method 1

a thin pressure- and temperature-resistant and moisture-blocking insulation layer along a surface contour of the connection device

Methodology Applied

Scientific EffectMoisture blocking: Physical Containment

Implementation Method 2

pressure- and temperature-resistant and moisture-blocking insulation layer

Methodology Applied

Scientific EffectThermal resistance: Thermal Insulation

Implementation Method 3

a film-based connection device, embodied alternately with at least two electrically conductive, intrinsically structured films and an electrically insulating film

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9883596B2Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewith

Publication Date: 2018.01.30 SEMIKRON DANFOSS ELEKTRONIK GMBH & CO KG

AI summary

A method for producing a power electronic switching device comprising a substrate, having a power semiconductor component arranged thereon; a connection device, and terminal devices. The method comprises: Providing the substrate with an insulation ply and conductor tracks electrically insulated from one another, wherein a power semiconductor component is arranged on a conductor track and is cohesively connected thereto; Arranging the connection device embodied as a film stack; Arranging a thin pressure- and temperature-resistant and moisture-blocking insulation layer along a surface contour of the connection device and comprising a covering section and an overlap section, which overlaps the connection device circumferentially and covers the substrate in a circumferential contact region; Cohesively connecting the connection device to the substrate, whereby the connection device connects the switching device in a circuit-conforming manner internally; Connecting the covering section to the connection device; Connecting the overlap section to the contact region.