Component Mounter Warpage Correction via Vacuum Suction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing component mounters face challenges in accurately correcting warpage and performing appropriate pressure-bonding of components onto thin panels, which are prone to deformation such as wrinkles or warpage, leading to defects in the manufacturing process.
Innovation Solution
A component mounter equipped with a board holder, backups with suction ports, and a sucking unit that performs vacuum-sucking of the board's undersurface, along with pressure-bonding heads, allows for precise control and effective pressure-bonding of components onto thin panels by adjusting the suction height and ensuring uniform heat and pressure application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a backup stage is used to support components from below during pressure-bonding, then the structural support is improved, but the warpage correction capability deteriorates
Solution Approach 1:
The patent introduces a warpage correcting unit as an intermediary device between the backup stage and the board. This unit includes suction ports that apply localized vacuum forces to specific regions of the board, enabling independent warpage correction without interfering with the overall structural support provided by the backup stage. The intermediary mechanism resolves the contradiction by adding a specialized function rather than compromising the existing support structure.
Solution Approach 2:
The backup stage is segmented into multiple independent backup units, each capable of providing localized support. This segmentation allows different regions of the board to be supported independently while the warpage correcting unit applies localized suction forces to specific areas needing correction. The segmented structure enables simultaneous structural support and warpage correction without mutual interference.
2Shape
If a warpage correcting unit with suction ports is added to correct board warpage, then the shape control is improved, but the device complexity increases
Solution Approach 1:
The backup units are designed with dual functionality: they provide structural support from below and incorporate suction ports for warpage correction. This multi-functionality eliminates the need for completely separate warpage correction mechanisms, reducing overall device complexity while maintaining effective shape control. The same structural elements serve multiple purposes.
Solution Approach 2:
The warpage correction function is merged with the backup stage structure. The suction ports are integrated into the backup units, combining the support and correction functions into a single integrated system. This merging reduces the number of separate components and simplifies the overall device architecture while achieving both structural support and warpage correction.
3Adaptability or versatility
If thin panels are used for board applications, then the flexibility and adaptability are improved, but the manufacturing precision deteriorates due to warpage and deformation
Solution Approach 1:
The warpage correcting unit activates before the pressure-bonding process to pre-correct any warpage or deformation in the thin panel. By applying localized suction forces in advance, the board is flattened and positioned accurately before components are placed and bonded. This preliminary action ensures that subsequent manufacturing operations proceed with high precision despite the inherent flexibility of thin panels.
Solution Approach 2:
The system dynamically adjusts the suction pressure and distribution across different regions of the board to compensate for warpage. By changing the vacuum parameters locally, the thin panel is corrected to the appropriate flatness level required for precise pressure-bonding, maintaining manufacturing precision while preserving the panel's flexibility for various applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable and accurate pressure-bonding of components onto thin panels, preventing defects and ensuring consistent manufacturing quality even with thin, flexible boards.
Implementation Method 1
a sucking unit that is connected to the suction port and performs vacuum-sucking of the board placed on the plurality of backups
Data Source
AI summary
There is provided a component mounter that performs pressure-bonding of a plurality of components placed on the board, to the board, the component mounter including: a board holder that holds the board and lifts and lowers the held board; a plurality of backups that support, from a side below the board, at least one of the plurality of components placed on the held board and are each provided with a suction port which suctions an undersurface of the board; a sucking unit that is connected to the suction port and performs vacuum-sucking of the board placed on the plurality of backups; and at least one pressure-bonding head that performs pressure-bonding of the plurality of components placed on the suctioned board, to the board.