Partial Molding of Electronic Package Modules Using Mask Layers
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Solution Overview
Problem
Conventional electronic package modules that include photoelectric components, such as CMOS Image Sensors or LEDs, cannot be encapsulated with molding compounds due to incompatibility, which poses a challenge in protecting these components while ensuring normal operation.
Innovation Solution
An electronic package module design where a molding compound encapsulates at least one electronic component but not all, using a mask pattern layer to selectively cover and expose specific components, allowing partial coverage without affecting photoelectric components and protecting other components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding compound is used to encapsulate electronic components for protection, then reliability and protection are improved, but photoelectric components cannot be encapsulated which worsens the applicability and completeness of protection
Solution Approach 1:
The patent divides the encapsulation process into segments by introducing a mask pattern layer that selectively covers only certain components. The molding compound is applied in segments - it encapsulates non-photoelectric components while leaving photoelectric components exposed through openings in the mask layer, thus resolving the contradiction between providing protection and maintaining component-specific requirements
Solution Approach 2:
The patent applies different encapsulation qualities to different locations on the circuit board. Non-photoelectric components receive full encapsulation protection from the molding compound, while photoelectric components have localized openings that prevent encapsulation. This local differentiation in encapsulation quality allows the system to achieve overall protection while respecting the specific requirements of photoelectric components
2Ease of manufacture
If molding compound encapsulates all electronic components uniformly, then manufacturing simplicity is improved, but photoelectric components cannot operate normally which worsens functionality
Solution Approach 1:
The patent performs preliminary action by forming the mask pattern layer on the circuit board before applying the molding compound. This pre-established mask structure guides the subsequent encapsulation process, ensuring that photoelectric components are automatically excluded from encapsulation without requiring complex real-time control during the molding process, thus maintaining manufacturing simplicity while ensuring component functionality
Solution Approach 2:
The mask pattern layer serves as an intermediary element between the molding compound and the electronic components. It mediates the encapsulation process by selectively allowing the molding compound to contact non-photoelectric components while blocking contact with photoelectric components, thus enabling uniform application of encapsulation material while preserving the operational integrity of sensitive components
Data Source
AI summary
An electronic package module includes a circuit board having a supporting surface, at least one first electronic component, at least one second electronic component, and at least one molding compound. The first and second electronic components are mounted on the supporting surface. The molding compound is disposed on the supporting surface and covers the supporting surface partially. The molding compound encapsulates the first electronic component yet not the second electronic component.