Surplus Conductive Ball Removal via Adhering Head
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Solution Overview
Problem
Existing methods for forming bump electrodes by mounting conductive balls on wiring substrates often result in surplus balls being left on the substrate, leading to the formation of extra-large bump electrodes, which reduces yield and requires cumbersome manual removal.
Innovation Solution
A conductive ball mounting method using a mask with opening portions, where surplus balls are adhered onto an adhering head using an adhesive material and image recognition for precise removal, allowing for automated and pinpoint removal without damaging normal balls or the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a brush is used to move solder balls toward one end side of the mask, then most solder balls are swept out, but extra solder balls remain in the opening portions area and drop onto the substrate
Solution Approach 1:
The invention extracts and removes surplus solder balls from the mask using a suction device with a suction hole. The suction device selectively removes extra balls that remain after the brushing process, preventing them from dropping onto the substrate while preserving the normally mounted balls.
Solution Approach 2:
The invention introduces a suction device as an intermediary between the brushing process and the substrate mounting. This intermediary device captures and removes surplus balls through the mask opening portions using suction, acting as a mediator that prevents harmful drops onto the substrate.
2Manufacturing precision
If manual removal of surplus balls is performed, then yield is improved, but the process becomes cumbersome and productivity decreases
Solution Approach 1:
The invention replaces the manual mechanical removal process with an automated suction-based system. The suction device, controlled by a control unit, automatically identifies and removes surplus balls through the mask, eliminating the need for cumbersome manual operations while maintaining high precision.
Solution Approach 2:
The system enables self-service removal of surplus balls through automated detection and suction. The control unit automatically controls the suction device to remove only surplus balls without human intervention, making the process both precise and efficient.
3Productivity
If the mask is jolted to remove surplus balls, then some balls are removed, but normal solder balls may also roll and drop onto the substrate
Solution Approach 1:
The suction device serves as an intermediary that selectively removes surplus balls through the mask opening portions without physically disturbing the substrate-mounted balls. This intermediary approach prevents the harmful effect of jolting that causes normal balls to roll and drop.
Solution Approach 2:
The invention extracts surplus balls through the mask using suction, removing them directly from the mask surface without jolting. This extraction method selectively targets surplus balls while leaving normally mounted balls undisturbed on the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively removes surplus balls, improving production efficiency and ensuring reliable mounting of one conductive ball per connection pad, preventing damage and residue, and enhancing yield by automating the surplus ball removal process.
Implementation Method 1
surplus balls are adhered onto an adhering head using an adhesive material
Data Source
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Figure 5
AI summary
A conductive ball mounting method of the present invention, includes a step of, arranging a mask (40) in which an opening portion (40a) is provided, on a substrate (1) including a connection pad (C1), arranging a conductive ball (62) on the connection pad (C1) through the opening portion (40a) of the mask (40) by supplying the conductive ball (62) onto the mask (40), separating the substrate (1) and the mask (40), in the step, an extra conductive ball (62) left on the mask (40) drops through the opening portion (40a) of the mask (40), thereby a surplus ball (62a) is mounted on the substrate (1), and removing the surplus ball (62a) on the substrate (1) by making the surplus ball (62a) adhere onto an adhering head (78).