Dual-Support Power Module for Balanced Thermal Evacuation
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Solution Overview
Problem
Existing power electronic modules face inefficiencies in heat removal and thermal imbalance due to smaller thermal contact surfaces between components and connection plates, leading to reduced heat evacuation efficiency and mechanical issues from temperature differences.
Innovation Solution
The design features a redundant arrangement of components on two supports, allowing for balanced thermal distribution and flexible electrical connections, with components operating in parallel and connected via solder bridges or ball brazing for enhanced thermal and electrical reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are connected to a connection plate with smaller thermal contact surface, then electrical connections are established, but heat evacuation efficiency is reduced
Solution Approach 1:
The invention divides the thermal management function into two separate supports (first support and second support) instead of using a single connection plate. Each support provides both electrical connection and thermal evacuation pathways, segmenting the heat evacuation function to ensure that each component has adequate thermal contact surface area while maintaining electrical connectivity.
2Device complexity
If all components are connected to a single support, then device complexity is reduced, but thermal imbalance occurs
Solution Approach 1:
The invention employs an asymmetric dual-support configuration where components are strategically distributed between the first and second supports. This asymmetric arrangement allows for balanced thermal evacuation across both supports while maintaining relatively simple device architecture, avoiding the complexity of more elaborate thermal management systems.
3Loss of energy
If components are arranged to balance thermal distribution on two supports, then heat evacuation is optimized, but electrical circuit flexibility is limited
Solution Approach 1:
The invention creates a universal support structure where both the first and second supports serve multiple functions: electrical connection, thermal evacuation, and mechanical support. This multi-functional design allows components to be flexibly arranged in various electrical circuit configurations (series, parallel, or mixed) while maintaining balanced thermal distribution, as either support can handle both electrical and thermal loads independently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures balanced heat evacuation and reliable electrical connections, maintaining thermal balance regardless of operating conditions and allowing for flexible component configurations without limiting admissible electrical circuits.
Implementation Method 1
the connections between each component and the connection plate define a much smaller thermal contact surface than that between each component and the support. This results in heat removal with reduced efficiency
Implementation Method 2
mechanical problems related to the temperature difference between the support and the connection plate and the resulting difference in thermal expansion
Data Source
Figure 1~2
Figure 3A~4
Figure 5A~5B
AI summary
The invention relates to a power electronic module (1) comprising at least one pair (30, 35, 40, 45) of power electronic components (31, 32, 36, 37, 41, 42, 46, 47), each pair (30, 35, 40, 45) comprising a first and a second component (31, 36, 41, 46, 32, 37, 42, 47), each component (31, 32, 36, 37, 41, 42, 46, 47) comprising a first face, intended to be supported on a support (10, 20) and a second face intended to be electrically connected to an electrical circuit with a thermal contact area smaller than that between the first face (31a, 32a, 36a, 37a, 41a, 42a, 36a, 37a) and the support (10, 20), and a first and a second support (10, 20).The first component (31, 36, 41, 46) of each pair is supported by the first support (10) and connected to a second electrical circuit of the second support (20), and the second component (32, 37, 42, 47) of each pair is supported by the second support (20) and connected to a first electrical circuit of the first support (10). The invention also relates to a method for manufacturing such a module (1).