Multi-Layer PCB Design for Reduced Thickness and High Component Density
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Solution Overview
Problem
The increasing thickness of printed circuit boards due to embedded electronic components poses a challenge for reducing the overall thickness while maintaining effective component mounting and connectivity.
Innovation Solution
A printed circuit board design featuring a first base substrate with an embedding part and a cavity for the second element, along with a second base substrate bonded to the first with a via for the second element, and an insulating layer in between, allowing for reduced thickness through strategic layer formation and bonding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are embedded in the substrate to increase functionality, then component density and versatility are improved, but the thickness of the printed circuit board increases
Solution Approach 1:
The printed circuit board is divided into multiple layers including a first substrate with embedded components, a second substrate, and an insulating layer. This segmentation allows components to be distributed across different layers rather than all embedded in a single thick substrate, thereby maintaining component density while reducing overall board thickness.
Solution Approach 2:
The patent transitions from a single-layer embedding approach to a multi-layer structure where components are arranged in three-dimensional space across multiple substrates. By utilizing the vertical dimension with thin insulating layers between substrates, the design achieves high component density without proportionally increasing overall thickness.
2Adaptability or versatility
If multiple components are mounted on the board to enhance functionality, then device versatility is improved, but structural complexity increases
Solution Approach 1:
The multi-layer substrate structure serves multiple functions simultaneously: it provides mechanical support, electrical connectivity through vias, insulation between layers, and component mounting surfaces. This universal design allows the same structural elements to fulfill multiple roles, enhancing device functionality without proportionally increasing structural complexity.
Solution Approach 2:
The patent embeds components within cavities in the first substrate, then places the second substrate over them with an insulating layer in between. This nested arrangement allows multiple functional elements (embedded components, circuit traces, vias, insulating layers) to be integrated within a compact hierarchical structure, achieving high functionality with controlled complexity.
Data Source
AI summary
Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element; a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element.