Printed Circuit Board with Inclined Side Surface for Multi-Layer Bonding
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Solution Overview
Problem
Existing printed circuit board arrangements with perpendicular configurations face limitations in flexibility and the number of connections, particularly when using flex foils, which restricts the ability to connect boards around corners effectively and limits the number of contacts to two layers.
Innovation Solution
A printed circuit board arrangement featuring alternating layers of electrically conductive and insulating materials, with inclined side surfaces to facilitate independent bonding of conductive layers, allowing for flexible connections and increased contact points, and a method of fabricating such boards with angled surfaces for enhanced bonding capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flex foils are used to interconnect perpendicular circuit boards, then cost-effective connection is achieved, but flexibility and the number of contacts are limited to maximal two layers
Solution Approach 1:
The patent transitions from planar connections to three-dimensional connections by utilizing the vertical side surface of the circuit board. Multiple conductive layers are exposed on the inclined side surface, allowing bond wires to access and connect to multiple layers simultaneously, thereby increasing the number of contacts beyond the two-layer limitation of flex foils.
Solution Approach 2:
The circuit board is segmented to expose multiple conductive layers on the side surface through inclined cutting. This segmentation allows each conductive layer to be independently accessed and connected via bond wires, enabling flexible multi-layer connections without the constraints of flex foil configurations.
2Adaptability or versatility
If multiple conductive layers are exposed on an inclined side surface, then independent bonding and increased contact points are achieved, but manufacturing complexity increases
Solution Approach 1:
The circuit board is pre-cut with an inclined side surface during the manufacturing process, exposing the multiple conductive layers before the bonding operation. This preliminary action simplifies the subsequent bonding process by providing ready access to all required contact points on the side surface, reducing the complexity of the assembly operation.
3Adaptability or versatility
If bond wires are used to connect multiple conductive layers on inclined surfaces, then flexible connections around corners are enabled, but precision of bonding increases difficulty
Solution Approach 1:
The circuit board features an asymmetric inclined side surface with a specific angle (e.g., 45 degrees) that optimizes the exposure of conductive layers. This asymmetric geometry provides favorable bonding angles and accessible contact points, reducing the precision difficulty compared to bonding on vertical or irregular surfaces while enabling flexible corner connections.
Data Source
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AI summary
The invention describes a printed circuit board with a top side and a bottom side, the printed circuit board comprising at least two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) for transmitting electrical current and at least one electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) comprising electrically insulating material, wherein the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) and the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j) are arranged in an alternating assembly such that the two electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) are electrically insulated with respect to each other by means of the electrically insulating layer (102, 104, 106, 108, 202, 204, 302, 304, 202i, 204i, 202j, 204j), wherein each of the electrically conductive layers (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) is adapted to be coupled to a bond wire (460a, 460b) independently from the other electrically conductive layer (112, 114, 116, 212, 214, 312, 314, 212i, 214i, 212j, 214j) at a side surface of the printed circuit board being inclined to the top side and the bottom side of the printed circuit board. The invention further describes a corresponding method of fabricating the printed circuit board. The invention further describes a printed circuit board arrangement comprising the printed circuit board and a corresponding method of fabricating the printed circuit board arrangement.