Electronic Component Mounting Structure for Resist Film Clearance
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Solution Overview
Problem
Conventional mounting structures of electronic components face issues where external electrodes interfere with resist films, leading to insufficient soldering due to improper alignment with electrode pads.
Innovation Solution
A mounting structure is designed with a separation distance between the external electrodes and resist film, ensuring the electrodes are reliably connected to electrode pads, using a surface layer of at least 99 wt% Sn to facilitate good bonding during reflow mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external electrode is placed close to the electrode pad to improve connection reliability, then the bonding quality improves, but the external electrode may interfere with the resist film causing insufficient soldering
Solution Approach 1:
The harmful factor (interference with resist film) is extracted and eliminated by designing the mounting structure such that the external electrode is positioned to contact only the electrode pad without overlapping or interfering with the resist film pattern, thus achieving reliable bonding without soldering defects
Solution Approach 2:
The potential harmful effect of resist film interference is prevented in advance by establishing proper spatial relationships in the mounting structure design, ensuring the external electrode contacts the electrode pad at a location that does not cause the electrode to interfere with the resist film during the soldering process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable contact between external electrodes and electrode pads, preventing interference with resist films and achieving stable soldering, thereby improving bonding quality.
Implementation Method 1
external electrodes of a two-terminal electronic component such as a multilayer ceramic capacitor or an inductor are connected to a board having a circuit by metal bonding such as soldering to a pair of electrode pads provided on the board
Data Source
AI summary
A mounting structure of an electronic component includes at least two electrode pads spaced apart from each other on a board, at least two external electrodes of the electronic component respectively connected to the at least two electrode pads, and a resist film located around each of the at least two electrode pads on a surface of the board. A predetermined separation distance in a surface direction of the board is set between the resist film and each of the at least two external electrodes provided respectively on the at least two electrode pads. At least a surface layer of each of the at least two external electrodes includes about 99 wt % or more of Sn.