Component Mounting Substrate With Adjusted Interlayer Conductors
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Solution Overview
Problem
Flip chip components with columnar electrodes of different cross-sectional areas experience electric connection failures and reduced bonding strength due to uneven solder thickness, leading to tilting during mounting on a substrate.
Innovation Solution
A component mounting substrate with a multilayer structure, featuring first and second connection conductors that adjust their positions to compensate for the thickness differences caused by varying cross-sectional areas of the columnar electrodes, ensuring even bonding and preventing tilting through the use of interlayer connection conductors and recess portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive bonding portions are formed by solder on columnar electrodes with different cross-sectional areas, then the component can be electrically connected to the mounting substrate, but the bonding portions become uneven in thickness causing the component to tilt
Solution Approach 1:
The mounting substrate is designed with non-uniform structure where connection conductors are positioned at different depths corresponding to the cross-sectional areas of different columnar electrodes. Larger electrodes connect to conductors positioned deeper in the substrate, while smaller electrodes connect to conductors positioned shallower, creating local适应性 that compensates for the electrode size variations and ensures uniform bonding portion thickness.
Solution Approach 2:
The position of connection conductors in the mounting substrate is varied as a parameter to match the different cross-sectional areas of columnar electrodes. By changing the depth position of connection conductors based on electrode size, the system compensates for the thickness difference in conductive bonding portions and prevents component tilting.
2Adaptability or versatility
If columnar electrodes with different cross-sectional areas are used, then the component can accommodate different electrical connection requirements, but the component tilts during mounting due to uneven solder thickness
Solution Approach 1:
The mounting substrate employs local quality variation by positioning connection conductors at different depths within the substrate. Each connection conductor's depth is specifically matched to the cross-sectional area of its corresponding columnar electrode, creating a localized adaptation that maintains component stability while preserving the ability to handle different electrode sizes.
3Reliability
If the component is mounted on the main surface of the mounting substrate, then electrical connection can be established, but bonding strength is reduced due to component tilting
Solution Approach 1:
The depth position parameter of connection conductors is adjusted to match the cross-sectional area parameter of columnar electrodes. This parameter matching ensures that conductive bonding portions have uniform thickness, which prevents component tilting and maximizes bonding strength while maintaining reliable electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents electric connection failures and maintains bonding strength by canceling out thickness differences, ensuring the component remains parallel to the substrate, thus enhancing the reliability of the mounting process.
Implementation Method 1
a thickness (length in a lamination direction) of the second conductive bonding portion is larger than a thickness of the first conductive bonding portion due to a difference in a growth speed of a plating film, which is caused by a difference in the cross-sectional area of the columnar electrode
Data Source
AI summary
An interlayer connection conductor penetrates through first layers of a multilayer body and projects from an upper surface. In a component mounting substrate, the projection length of the interlayer connection conductor from the upper surface in the lamination direction is adjusted such that a difference between a connection position of the interlayer connection conductor and a conductive bonding portion and a connection position of a connection electrode and a conductive bonding portion in the lamination direction is a difference. A difference between the length of the conductive bonding portion and the length of the conductive bonding portion in the lamination direction is canceled by the difference. As a result, the upper surface and a lower surface are parallel with each other to prevent a high-frequency component from tilting with respect to a mounting substrate, thereby preventing electric connection failure and lowering of bonding strength due to the tilt.