Printed Circuit Assembling TRIZ Cases

A bent display panel routes electrical lines from edge sensors to a circuit board via flex conductors.

A computer program product generates a 3D chip stack plan to integrate heterogeneous semiconductor components.

Interleaved lead fingers in a single layer frame reduce connection resistance and inductance for efficient power transfer.

A signal transmission apparatus uses a port connection member to join flexible printed circuit boards without soldering.

A wiring substrate connection terminal uses a composite metal structure to fill hollows in the base portion.

Slicing an encapsulated wiring block creates discrete chip carrier panels with conductive vias, reducing production costs while maintaining reliability.

Segmented sensors measure component height accurately while maintaining transfer head positioning precision.

Adjacent same polarity pin orientation reduces conducting wire count, allowing tighter spacing between light source units on a substrate to boost brightness.

A white layer on a circuit board land scatters reflected laser light during pin welding to manage heat absorption.

Protective layer in isolation gap induces capacitance to offset parasitic inductance from protruding signal pins.

An ejector integrates a sensor arrangement to detect viscous droplets in flight, eliminating time-consuming downstream inspections.

A manufacturing method uses a closed gluing frame to bond transparent film electrodes to glass substrates for precise alignment.

Solidified encapsulating compound forms the protective housing and plug body, eliminating separate components to reduce device complexity.

Rotating press rollers maintain constant pressure on lead wires during ultrasonic vibration bonding to ensure accurate substrate attachment.

A scalable switching regulator architecture integrates an inductor using micro-bumps and redistribution layers to create optimized magnetic field paths.

Non-conductive through-holes in a circuit board central solder pad vent gaseous flux, preventing voids and improving bond quality.

A protective layer isolates stretchable wiring from rigid substrates to maintain electrical connectivity during mechanical deformation.

A silicone-based wiring board features a silica film on plating layers to enhance wire bonding strength and maintain reflectance.

Pressing unfired ceramic substrates at cut positions creates perpendicular end surfaces, resolving angled break issues and improving production efficiency.

A separate circuit board joins an IMS printed circuit board using mixed mounting technologies to secure power connectors.

SnBi solder paste diffuses Sn-Ag preforms to form intermetallic layers, resolving brittle joint failures under drop impacts.

Standing the component vertically reduces mounting area while specialized Ni-Sn and Au plating layers enable separate solder and wire bonding connections.

Multi-layer organic laminated substrate integrates IC chips and passive devices, reducing package area by 42.24% while enabling e-payment functionality.

A substrate groove collects evaporated flux and retains molten solder, preventing pressure buildup and solder ball formation.

Stacked expanded circuit board with bent terminals suppresses crosstalk interference at high transmission speeds without requiring welding.

Variable wirebond density addresses fabrication cost trade-offs by reinforcing high-emission areas while reducing material in low-interference zones.

A film thickness gauge forms measurement marks in a flux film for optical detection by an imaging section.

Optimized Sn-Bi-Cu-Ni-Ge-Co solder alloy composition maintains high bonding strength and wettability.

A component mounting substrate uses interlayer connection conductors to adjust projection lengths for parallel surface alignment.

A terminal base connects power module pins directly to an electrical wire, bypassing the printed circuit board copper foil.

A printing device manages solder paste on a screen mask using a timer that weighs movement intervals against stationary periods.

Ferrite hold-down devices concentrate magnetic fields to enable precise induction soldering of solar cell conductors.

Selective nickel/gold plating on specific circuit traces reduces manufacturing costs while maintaining durability and current carrying capacity.

A lead-free solder alloy composition precipitates strengthening compounds to enhance mechanical strength and thermal shock resistance.

Printed dielectric ramps and ground planes dissipate heat from high power components, reducing manufacturing costs associated with clean room deposition.

A form-fitting adhesive joint aligns a piezoelectric actuator with a printed circuit board before bonding to ensure stable electrical contact.

A spacer with locating cut-outs restricts solder pre-form flow to defined heat sink areas for secure RF device attachment.

Looped wire interconnects join substrates via stud balls to increase bonding surface area and mechanical attachment.

Hardened protective coating shields cavity bottom copper from etching damage, ensuring reliable component fixation without intermediate wires.

Auto-agglutination solder joins electronic components to display substrates using heated thermosetting resin and solder particles.

Conductive sheets enable removable mechanical switches, solving the trade-off between electrical connection reliability and ease of replacement.

A one up one down electrical connection structure exposes conductive terminals through opposite substrate surfaces for reliable soldering.

A processing device segments a printed circuit board into subareas based on solder paste transfer repeatability to optimize control parameters.

Tin-nickel alloy barrier prevents copper diffusion into lead-free solder bumps, improving mounting reliability.

Dispensing conductive fluid forms thick antenna traces, reducing capital costs and improving space efficiency.

Flat contact areas on round cross-section wires enable automated camera-guided welding, eliminating hazardous print-and-etch chemicals.

A pedestal with an inclined guide part maintains clearance between connection terminals and through-holes in semiconductor devices.

Stamping metal foil onto films eliminates slow drying times and high costs of conductive ink.

Eccentric connecting terminals with reduced cross-sections minimize mount regions while distributing current to reduce heat generation in semiconductor devices.

Shielding portion electrically connects to substrate ground via embedded conductors along the connection portion external surface.