Electronic Module with Integrated Encapsulated Plug Connection
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Solution Overview
Problem
Conventional electronic modules for engine or airbag control units require separate housings and additional sealing elements to protect against environmental influences, which increases complexity and costs.
Innovation Solution
An electronic module with a circuit carrier surrounded by a solidified encapsulating compound forms both the protective housing and plug body, eliminating the need for separate housings and sealing elements, and allowing for a single manufacturing process to create a sealed plug connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate housings and sealing elements are used to protect electronic circuits from environmental influences, then protection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the protective housing and plug body into a single integrated structure formed by one encapsulating compound. The circuit carrier is surrounded by at least one solidified encapsulating compound that forms both the protective housing and the plug body with connector collar, eliminating the need for separate housing components and sealing elements. This integration maintains protection reliability while reducing device complexity.
Solution Approach 2:
The encapsulating compound serves multiple functions simultaneously: it provides environmental protection, structural support, and plug connection functionality. The single encapsulating compound forms both the protective housing and the plug body, making the system more universal and reducing the number of separate components needed.
2Reliability
If separate housings and multiple components are used, then protection reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple manufacturing steps into a single injection molding process. The encapsulating compound is introduced into a mold cavity in one step, forming both the protective housing and plug body simultaneously, which reduces manufacturing cost while maintaining protection reliability.
Solution Approach 2:
The circuit carrier is pre-assembled with electronic components before being placed in the mold cavity. This preliminary assembly allows the final encapsulation step to create the complete protected structure in one operation, reducing overall manufacturing complexity and cost.
3Reliability
If separate housings and sealing elements are used, then protection reliability is improved, but the number of manufacturing steps increases
Solution Approach 1:
The patent merges multiple manufacturing operations into a single injection molding process. The encapsulating compound is introduced into the mold cavity and solidifies to form both the protective housing and plug body in one continuous operation, eliminating multiple assembly steps and improving productivity while maintaining protection reliability.
4Reliability
If separate plug bodies and housings are used, then connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the plug body and housing into a single integrated structure formed by the encapsulating compound. The plug body is formed as an integral part of the encapsulated structure with the circuit carrier, eliminating the need for separate plug and housing components while maintaining connection reliability through the unified material structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively protects the electronic circuit from environmental factors, reduces component count and manufacturing steps, and lowers costs by integrating the plug connection and housing in a single, robust encapsulating compound.
Implementation Method 1
at least one solidified encapsulating compound, forming a protective housing (60)
Data Source
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AI summary
The invention relates to an electronic module comprising at least one populated circuit board with a plug connection for making electrical contact with a mating connector. The circuit board is enclosed, at least in sections, by at least one cured potting compound forming a protective enclosure. The plug connection comprises a connector body having at least one connector collar, wherein the connector body is formed from the at least one cured potting compound. Furthermore, a receptacle opening for the mating connector is formed by the connector collar, the receptacle opening extending to a connector base which is formed by a partial area of the circuit board kept free of the potting compound.