Pedestal Guide Part for Semiconductor Terminal Alignment
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Solution Overview
Problem
Conventional power semiconductor modules face issues with maintaining a gap between connection terminals and through-holes, leading to inadequate solder adhesion and reduced vibration resistance due to shifting terminal or hole formations during intense vibration.
Innovation Solution
A semiconductor device with a pedestal having a base and guide part with an inclined section is used, ensuring proper clearance and uniform solder thickness between the connection terminal and through-hole, enhancing adhesion and vibration resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection terminal and through-hole formation locations shift during manufacturing, then manufacturing precision is reduced, but the gap between connection terminal and through-hole cannot be maintained, leading to insufficient solder adhesion
Solution Approach 1:
The patent introduces a pedestal as an intermediary component between the connection terminal and the wiring board. This pedestal includes a guide part with an inclined side face that mediates the positioning relationship, ensuring that even when the connection terminal or through-hole locations shift during manufacturing, the pedestal maintains proper alignment and spacing, thereby ensuring sufficient solder adhesion without requiring high manufacturing precision for the terminal and hole formations.
Solution Approach 2:
The patent changes the geometric parameters of the pedestal structure, specifically designing the guide part with an inclined side face at a specific angle (30° to 60°). This parameter change allows the guide part to effectively maintain the gap between the connection terminal and through-hole while compensating for location shifts, thus improving solder adhesion reliability without demanding higher manufacturing precision.
2Reliability
If the gap between connection terminal and through-hole is not maintained, then manufacturing is easier, but solder thickness becomes non-uniform and adhesion decreases
Solution Approach 1:
The pedestal serves as a mediator that automatically maintains the required gap between the connection terminal and through-hole. The guide part with its inclined side face passively ensures proper spacing during assembly, eliminating the need for complex active control mechanisms or highly precise manufacturing processes, thus achieving vibration resistance without excessive device complexity.
Solution Approach 2:
The pedestal is pre-formed with the guide part having the inclined side face at the correct geometry before assembly. This preliminary action embeds the gap-maintaining function into the pedestal structure itself, so that during final assembly, the proper spacing is automatically achieved without requiring additional adjustment steps or complex real-time control mechanisms.
3Manufacturing precision
If connection terminal protrudes directly without guide structure, then device complexity is reduced, but positioning accuracy and solder joint quality deteriorate under vibration
Solution Approach 1:
The guide part of the pedestal acts as an intermediary positioning element between the connection terminal and the wiring board. This simple geometric feature (inclined side face) provides the necessary positioning function without requiring complex mechanisms, achieving high positioning accuracy while adding minimal structural complexity.
Solution Approach 2:
The patent applies the guide part with inclined side face only at the critical location where positioning is needed (at the base of the connection terminal), rather than making the entire device complex. This local application of the guiding structure provides positioning accuracy exactly where required, while keeping the rest of the device simple.
Data Source
AI summary
A semiconductor device includes: a sealed unit that seals a semiconductor element therein; a connection terminal that is electrically connected to the semiconductor element and is provided so as to project outward from the sealed unit; and a pedestal that is provided to surround a bottom part of an exposed portion of the connection terminal that is exposed from the sealed unit. The pedestal has a base attached to the sealed unit and a guide part that has an inclined side face.