Ultrasonic Bonding Tool Press Rollers Suppress Lead Wire Lift
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Solution Overview
Problem
Conventional pressurized ultrasonic vibration bonding apparatuses face challenges in reliably bonding lead wires to substrates due to lift (deflection) issues, particularly in regions between press members and bonding points, leading to incomplete bonding and potential wire lift during processing.
Innovation Solution
The apparatus incorporates first and second press mechanisms with rotational operation capabilities, allowing for press processing during ultrasonic vibration and movement processing after, ensuring consistent pressure on the lead wire to prevent lift and achieve accurate bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If press members are used to press the lead wire during ultrasonic vibration bonding, then lead wire deflection is suppressed at bonding points, but gaps between press members and bonding points remain unprotected leading to wire lift
Solution Approach 1:
The press mechanism is divided into multiple press members positioned at different locations along the lead wire. Each press member independently presses specific regions, allowing comprehensive coverage of bonding points and gap regions separately, thus preventing wire lift while maintaining bonding reliability
Solution Approach 2:
The press members are positioned and adjusted before ultrasonic vibration bonding begins. This preliminary positioning ensures that press members are correctly located to cover both bonding points and gap regions, preventing wire lift issues before they occur during the bonding process
2Manufacturing precision
If press members are positioned close to bonding points, then wire lift is prevented, but gaps between press members remain causing incomplete coverage
Solution Approach 1:
Multiple press members are distributed along the lead wire with specific spacing. This segmentation allows each press member to focus on specific regions (bonding points or gap regions) while collectively providing comprehensive coverage, ensuring both bonding precision and wire lift prevention reliability
Solution Approach 2:
Different press members are positioned to provide localized pressing at different regions of the lead wire. Some press members target bonding points while others target gap regions, providing locally optimized pressure distribution that ensures both bonding precision and prevents wire lift in previously unprotected areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses lead wire deflection and ensures reliable bonding by addressing lift issues in both gap formation regions and between bonding points, enhancing the bonding process's accuracy and reliability.
Implementation Method 1
a bonding tool executing an ultrasonic vibration processing of applying ultrasonic vibration to an application portion on a lead wire
Implementation Method 2
The work is strongly bonded to the predetermined member by energy of the pressure and the ultrasonic vibration
Data Source
AI summary
A bonding tool that executes an ultrasonic vibration processing of applying ultrasonic vibration to an application portion on a lead wire from a direct contact tip portion and a pair of press mechanisms having a pair of press rollers capable of performing a rotational operation. The pair of press mechanisms executes a press processing of pressing both sides of the application portion on the lead wire by the pair of press rollers at a time of execution of the ultrasonic vibration processing by the bonding tool and a movement processing of executing a rotational operation performed by the pair of press rollers to move the pair of press rollers on the lead wire while pressing the lead wire at a time of non-execution of the ultrasonic vibration processing.