High-Density SIM Card Package Using Organic Laminated Substrate
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Solution Overview
Problem
Existing SIM cards have limitations in size and functionality, failing to meet the requirements for more advanced functions and security due to their single-function, rigid packaging design.
Innovation Solution
A high-density SIM card package is developed using a two-layer to eight-layer organic laminated substrate with integrated IC chips, passive devices, and a crystal oscillator, connected via bonding wires, and molded using a specific process that reduces package size and increases functionality, incorporating multiple chips and passive devices in a compact, flexible form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional carrier tape packaging is used for SIM cards, then the package structure is simple and easy to manufacture, but the package size is large and functionality is limited
Solution Approach 1:
The patent combines multiple functional components (CPU, encryption chip, RF chip, passive devices) into a single integrated package structure. The organic laminated substrate integrates multiple IC chips and passive devices in one package, eliminating the need for separate carrier tapes and enabling multiple functions (mobile communication, e-payment, data downloading) in a compact form factor of 12mm×18mm×0.63mm.
Solution Approach 2:
The patent transitions from traditional two-dimensional carrier tape layout to a multi-layer three-dimensional organic laminated substrate structure. By stacking components across multiple layers (two-layer to eight-layer configuration) and utilizing vertical space, the design achieves high-density integration while reducing overall package footprint and enabling complex interconnections between components.
2Adaptability or versatility
If multiple IC chips are integrated in one package, then functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent segments the package into distinct functional modules: CPU chip, encryption chip, RF chip, and passive devices, each mounted on specific layers of the organic laminated substrate. This modular segmentation allows independent optimization of each component while maintaining overall integration, simplifying the manufacturing process compared to monolithic integration.
Solution Approach 2:
The patent implements a nested package structure where multiple IC chips are mounted on different layers of the organic laminated substrate, with each layer containing specific components. The multi-layer substrate acts as a container that nests various functional elements in a compact arrangement, reducing overall package complexity while enabling multiple functions.
3Length of moving object
If wafer thickness is reduced for thinner SIM cards, then card thickness is reduced, but wafer grinding precision requirements increase
Solution Approach 1:
The patent uses an organic laminated substrate composed of multiple layers bonded together, providing structural integrity while enabling thin profile. The composite structure of the multi-layer substrate distributes mechanical stresses and maintains dimensional stability even at reduced thickness (0.63mm), reducing the precision requirements for wafer grinding compared to monolithic thin substrates.
Data Source
AI summary
A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire. The IC chip, the passive device, and the crystal oscillator are adhered to the organic laminated substrate.