Vertical Ceramic Capacitor Mounting for Compact PCB Space
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Solution Overview
Problem
Conventional electronic components face challenges in being effectively mounted in limited spaces within devices like mobile phones and digital cameras due to their size and mounting requirements.
Innovation Solution
The proposed solution involves a ceramic electronic component with a ceramic element body having external electrodes with specific plating layers (Ni and Sn for solderability and Au for wire bonding) mounted on a substrate, where the component is oriented perpendicular to the substrate, reducing the mounting space required. This is achieved through a method involving cream solder application and wire bonding, allowing for efficient connection and reduced space usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional electronic components are mounted on a substrate in a traditional orientation, then the mounting process is simple, but the mounting space required is large
Solution Approach 1:
The patent applies dimensionality change by mounting the electronic component in a standing orientation perpendicular to the substrate surface, rather than the conventional flat orientation. This vertical arrangement reduces the horizontal mounting space occupied by the component while maintaining all necessary electrical connections through appropriately positioned land electrodes on the substrate
2Area of stationary object
If the electronic component is mounted perpendicular to the substrate, then the mounting space is reduced, but the connection method becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the connection function into multiple specialized land electrodes on the substrate, each positioned to connect with specific external electrodes of the vertically mounted component. This segmentation allows the complex vertical mounting task to be broken down into simpler, standardized connection points that can be manufactured using conventional PCB techniques
3Reliability
If external electrodes have only Sn plating layer, then solderability is good, but wire bonding connectivity is poor
Solution Approach 1:
The patent applies local quality by providing different plating layer configurations on different external electrodes of the same component. Specifically, one external electrode has an Sn plating layer optimized for solder connections, while another external electrode has an Au plating layer optimized for wire bonding. This localized differentiation allows each electrode to be optimized for its specific connection type without compromising the other
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the effective mounting of electronic components in limited spaces by minimizing the mounting area, improving solderability and wire bonding connectivity, and allowing for efficient use in compact devices.
Implementation Method 1
the first external electrode of the electronic component being connected to the mounting land electrode with solder
Implementation Method 2
the second external electrode of the electronic component being connected to the wire bonding land electrode via a bonding wire
Implementation Method 3
melting the cream solder and causing the electronic component to stand up on the mounting land electrode due to a surface tension of the cream solder; connecting the first external electrode of the electronic component to the mounting land electrode with solder by solidifying the cream solder
Data Source
AI summary
A multilayer ceramic capacitor includes a ceramic element body including first and second external electrodes on first and second end surface sides of the ceramic element body, respectively. The first external electrode includes an Ni plating layer and an Sn plating layer defining a plating layer. The second external electrode includes an Au plating layer defining a plating layer.