Eccentric Semiconductor Connecting Terminal for Compact Mounting
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Solution Overview
Problem
Conventional semiconductor devices have a large mount region for terminal electrodes, which increases the size of the device and can lead to thermal disadvantages due to concentrated electric current on a small top end surface, necessitating a reduction in the mount region for compactness and efficient heat management.
Innovation Solution
A semiconductor device design featuring connecting terminals with an external terminal connecting portion and a substrate-fixed portion, where the external terminal connecting portion is eccentrically located and includes a reduced sectional area portion, allowing for compact mounting of electronic components without a large mount region on the circuit board, and a seal attachment portion to secure a seal member for waterproofing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the cylinder portion is formed with a large top end surface area to provide sufficient connecting region for external wiring terminal, then the connecting region is improved, but the device size increases and heat concentration is reduced
Solution Approach 1:
The connecting terminal employs an asymmetric structure where the external terminal connecting portion is eccentrically positioned relative to the substrate-fixed portion. This asymmetric arrangement allows the top end surface to be enlarged for better external wiring connection while the overall footprint on the circuit board is minimized, resolving the contradiction between connecting region and device size
Solution Approach 2:
The invention transitions from a conventional symmetric radial arrangement to an asymmetric eccentric arrangement, effectively utilizing spatial dimensions differently. The external terminal connecting portion extends in a specific direction from the substrate-fixed portion, allowing optimized use of board space while maintaining sufficient top end surface area for external connections
2Temperature
If the cylinder portion is formed with a large top end surface area to distribute electric current, then heat generation is reduced, but the mount region on the circuit board increases
Solution Approach 1:
The asymmetric eccentric structure allows the top end surface area to be optimized for current distribution and heat dissipation while the mount region footprint is minimized. The external terminal connecting portion is positioned to maximize top surface area without proportionally increasing the overall mount region
Solution Approach 2:
The invention applies different functional qualities to different parts of the connecting terminal: the external terminal connecting portion has a larger top end surface area specifically optimized for current distribution and heat dissipation, while the substrate-fixed portion maintains a compact footprint for minimal mount region occupation
3Reliability
If the cylinder portion is made thick to provide sufficient connecting region, then the connecting reliability is improved, but the device size increases
Solution Approach 1:
The asymmetric eccentric structure optimizes the distribution of material in the connecting terminal. The external terminal connecting portion is positioned to provide sufficient connecting region and reliability while the overall volume is minimized through strategic spatial arrangement rather than uniform thickening
Data Source
Figure 1
Figure 2(a)~2(b)
Figure 3
AI summary
A connecting terminal (6,7,8) includes an external terminal connecting portion (30), having an end surface to connect an external terminal thereto and located at a second principal surface side (13a) of a second circuit board (13), and a substrate-fixed portion (31) which is securely connected to a first circuit board (11). A seal attachment portion (35) is provided on a portion of the external terminal connecting portion including the end surface to attach thereto a seal member (34) to seal a gap between the portion and the case (14). The connecting terminal includes a reduced sectional area portion having a sectional area smaller than an area of the top end surface in a region close to a plurality of electronic components (9) arranged on the second circuit board (13) on the external terminal connecting portion. The reduced sectional area portion is provided from the seal attachment portion to an end in the opposite side of the end surface.