Electronic Device Module Shielding Portion Ground Connection
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Solution Overview
Problem
There is a demand for miniaturized and lightweight electronic components, particularly in high-frequency electronic device modules, that require effective electromagnetic interference (EMI) shielding without compromising the performance of the antenna or increasing manufacturing complexity.
Innovation Solution
An electronic device module design featuring a substrate with a shielding portion electrically connected to the ground through connection conductors, which are embedded in an insulating portion and exposed externally, along with a sealing portion to protect the electronic devices, while maintaining the antenna's characteristics and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electromagnetic wave shielding structures are added to protect electronic devices, then EMI shielding performance is improved, but device complexity increases
Solution Approach 1:
The patent combines the shielding portion with the connection portion into a single integrated structure. The shielding portion is formed as an extension of the connection portion, eliminating the need for separate shielding components and reducing overall device complexity while maintaining effective EMI shielding coverage around the electronic device.
Solution Approach 2:
The connection portion serves dual functions: it provides electrical connection between the substrate and external device, and simultaneously acts as a shielding structure when extended to form the shielding portion. This multi-functionality reduces the number of separate components needed, addressing the complexity issue while maintaining shielding effectiveness.
2Volume of moving object
If the size of electronic components is reduced for miniaturization, then device size is decreased, but shielding effectiveness may be compromised
Solution Approach 1:
The shielding portion is strategically positioned only where needed - along the external surface of the connection portion where it interfaces with the electronic device. This localized shielding approach provides effective EMI protection for the critical connection area without requiring full-coverage shielding that would increase overall module size.
Solution Approach 2:
The shielding portion is nested within the connection portion structure, forming an integrated layered configuration. The shielding portion is disposed along the external surface of the connection portion, creating a nested arrangement that provides shielding functionality within the existing connection structure footprint, minimizing additional space requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent EMI shielding for electronic devices while maintaining the antenna's performance and simplifying the manufacturing process, ensuring the module's reliability and efficiency in protecting against external impacts and electromagnetic interference.
Implementation Method 1
a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate
Implementation Method 2
connection conductors connecting the substrate to an external device
Data Source
AI summary
An electronic device module includes: a substrate; at least one electronic device mounted on a first surface of the substrate; a connection portion mounted on the first surface of the substrate; and a shielding portion disposed along an external surface of the connection portion and electrically connected to a ground of the substrate through at least one connection conductor.