Power Connector Stability on IMS Boards via Segmented Circuit Design
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Solution Overview
Problem
The through-hole technology cannot be applied to IMS printed circuit boards, and power connectors attached using SMD technology are fragile due to high forces during connection and disconnection, leading to instability.
Innovation Solution
A circuit design where a separate circuit board with power connectors is fastened to the IMS printed circuit board using through-hole technology for the connectors and SMD technology for solder joints, distributing forces across multiple solder joints for stability, and optionally covered with a plastic box for added security.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power connector is attached using SMD technology on IMS printed circuit board, then the connector can be mounted on the board, but the connection becomes fragile due to high forces during connection and disconnection
Solution Approach 1:
The circuit board system is divided into two separate boards: an IMS printed circuit board and a separate circuit board. The power connector is mounted on the separate circuit board using through-hole technology, while the separate circuit board itself is attached to the IMS board using SMD technology with multiple solder joints. This segmentation allows each component to use the most appropriate mounting method for its requirements.
Solution Approach 2:
The separate circuit board acts as an intermediary between the power connector and the IMS printed circuit board. It transfers mechanical loads and electrical connections, protecting the IMS board from direct stress while enabling both through-hole and SMD mounting approaches in the overall system.
2Strength
If through-hole technology is used for power connector on IMS printed circuit board, then the connection becomes mechanically strong, but the technology cannot be applied to IMS boards
Solution Approach 1:
The system is segmented into two separate circuit boards, allowing the separate circuit board to use through-hole technology for the power connector while the IMS board uses SMD technology for attaching the separate board. This resolves the incompatibility of through-hole technology with IMS boards while preserving the mechanical strength benefits where applicable.
Solution Approach 2:
The solution moves the through-hole mounting operation to a different dimension - from the IMS board itself to a separate circuit board that then interfaces with the IMS board. This dimensional separation allows through-hole technology to be used in the overall system without directly conflicting with IMS board constraints.
3Reliability
If multiple solder joints are used to fasten separate circuit board, then the forces are distributed and stability is improved, but the device complexity increases
Solution Approach 1:
Multiple solder joints are combined into a single separate circuit board assembly. Instead of individually mounting the power connector to the IMS board with multiple separate connections, all connections are consolidated through the separate board, which distributes forces across multiple solder joints while presenting a unified interface.
Data Source
Figure 1~2
Figure 3
AI summary
The present invention relates to an electric and/or electronic circuit including a printed circuit board (20), at least one separate circuit board (10) and at least one power connector (12) for said printed circuit board (20). The at least one power connector (12) is connected or connectable to a corresponding counterpart. A number of electric and/or electronic components (22) is sold at the separate circuit board (10). The at least one separate circuit board (10) is connected to the printed circuit board (20) by a number of solder joints (16). The solder joints (16) are connected to the separate circuit board (10) by a through-hole-technology. The solder joints (16) are connected to the printed circuit board (20) by SMD (surface mount device) technology. At least one power connector (12) is fastened at the separate circuit board (10) by the through-hole-technology.