Round Wire Circuit Arrangement with Flat Contact Areas
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Solution Overview
Problem
Existing methods for attaching wiring to electronic devices like RF transponders and LEDs on flexible substrates are costly and environmentally hazardous due to the use of print-and-etch processes, and automated wire bonding machines face challenges in locating and bonding fine gauge round wires effectively.
Innovation Solution
A circuit arrangement using round cross-section wires with flat contact areas formed at intersections, which are easily detected and bonded by camera-guided welding machines, eliminating the need for expensive chemicals and hazardous waste, and allowing for stable wire connections to electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If print-and-etch processes are used to create wiring patterns on flexible substrates, then wiring can be formed on substrates, but the process becomes expensive and generates hazardous waste
Solution Approach 1:
The patent extracts the harmful print-and-etch process entirely from the manufacturing workflow. Instead of using chemical-based wiring formation, the invention uses mechanically attached round wires that are bonded to the substrate and electronic devices, completely eliminating the need for expensive chemicals and hazardous waste generation while maintaining effective electrical connectivity
Solution Approach 2:
The patent employs simple, inexpensive round wires as temporary-looking but permanent-function conductors. These round wires replace the complex, expensive photomask and etching chemistry infrastructure, providing a low-cost, disposable-friendly approach to wiring that doesn't require sophisticated manufacturing equipment or hazardous material handling
2Ease of manufacture
If fine gauge round wires are used for wiring, then cost and environmental impact are reduced, but automated wire bonding machines have difficulty locating and bonding to the wires
Solution Approach 1:
The patent applies local quality by creating flat contact areas at specific locations on the round wires where bonding is required. While the wires themselves remain simple round cross-section for most of their length, the bonding zones are locally modified to have flat surfaces that are easily detectable by camera-guided systems and provide stable bonding surfaces for automated wire bonding machines
Solution Approach 2:
The flat contact areas act as intermediaries between the round wire structure and the automated wire bonding process. These flat zones serve as detection targets for cameras and as stable bonding surfaces for the bonding tool, mediating the interaction between the simple round wire and the complex automated bonding system without requiring the entire wire to be complex
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and cost-reduces the attachment of wiring to electronic devices, using low-cost materials and fewer hazardous chemicals, while providing durable and stable wire bonds, enhancing manufacturing efficiency and environmental sustainability.
Implementation Method 1
Cross wires and one or more wire segments are attached to a substrate with an adhesive
Implementation Method 2
a first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire connected to the electronic device and to the second portion of the one or more wire segments
Data Source
AI summary
A disclosed circuit arrangement includes adhesive transfer tape, and an electronic device attached to adhesive of the adhesive transfer tape. First and second cross wires are attached to the adhesive and are disposed proximate the electronic device. One or more wire segments are attached to the adhesive and have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments have round cross sections, the first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. First and second bond wires are connected to the electronic device and to the first and second portions of the one or more wire segments, respectively.