Gold Pad Mini PCB Module Selective Plating
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Solution Overview
Problem
The existing construction of electrical printed circuit boards (PCBs) incurs unnecessary expense when all circuit traces need to be coated with nickel/gold for increased durability and current carrying capacity, as it is impractical to coat only a subset of traces selectively.
Innovation Solution
A PCB assembly is designed with a first board featuring copper circuit traces and a second board with nickel/gold plated copper traces, where terminations are soldered to the first traces, allowing for targeted use of expensive plating only where necessary, and incorporating a pushbutton switch or elastomeric connector to contact the plated traces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all circuit traces are coated with nickel/gold to increase durability and current carrying capacity, then the reliability and performance of the PCB is improved, but the manufacturing cost increases significantly
Solution Approach 1:
The patent applies nickel/gold plating only to specific circuit traces that require enhanced durability and current carrying capacity, rather than plating all traces uniformly. This is achieved by using a selective plating process that targets specific trace locations, thereby reducing material costs while maintaining reliability where needed.
Solution Approach 2:
The PCB is divided into different zones with different plating requirements. Some traces are plated with nickel/gold while others remain as bare copper or have different finishes. This segmentation allows the manufacturing process to apply expensive plating materials only where necessary, resolving the contradiction between reliability and manufacturing cost.
2Ease of manufacture
If selective coating of subset of traces is implemented to reduce cost, then the manufacturing cost is reduced, but the manufacturing complexity increases due to impracticality of selective coating
Solution Approach 1:
The patent introduces an intermediary layer or masking technique that enables selective plating of traces. This intermediary mechanism allows the coating process to target specific traces without requiring complex manual application, thereby reducing both cost and process complexity compared to uniform plating of all traces.
Solution Approach 2:
The patent modifies plating process parameters such as electroplating current distribution, mask material properties, or chemical bath composition to enable selective deposition of nickel/gold on specific traces. These parameter changes allow automated selective plating, reducing manufacturing complexity while achieving cost savings through targeted material application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for cost-effective use of nickel/gold plating by applying it only where required, enhancing durability and current carrying capacity without unnecessary expense, while maintaining functionality in keypads and similar devices.
Implementation Method 1
second circuit traces that are formed of nickel/gold plated copper
Implementation Method 2
terminations that are soldered to the first circuit traces
Data Source
AI summary
A printed circuit board (PCB) assembly includes a first printed circuit board that includes first circuit traces formed of copper. A second printed circuit board includes second circuit traces that are formed of nickel/gold plated copper and terminations that are soldered to the first circuit traces. An electrical component contacts the second circuit traces.