Electronic Component Package With Cushioning Layer
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Solution Overview
Problem
Conventional electronic component packages are prone to damage from pressure shocks during the mold resin process due to the high pressure exerted between the component cover and the mounting substrate, especially where recesses are thin and exposed to mold resin pressure.
Innovation Solution
Incorporating a protective member with a lower elastic modulus than the mold resin on the component cover, which is positioned to receive pressure and elastically deform to disperse stress, thereby reducing the risk of damage from external pressures during the mold resin filling process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If recesses are disposed in the component cover to prevent contact with IDT electrodes, then the component cover can protect elements, but the component cover becomes very thin and vulnerable to pressure damage
Solution Approach 1:
The component cover is segmented into multiple regions: thick portions that provide structural strength and thin portions with recesses that provide protection functionality. This segmentation allows different parts of the same component to serve different purposes - the thick portions resist pressure while the recessed portions protect the IDT electrodes from contact
Solution Approach 2:
The invention introduces a cushioning layer between the component cover and the mounting substrate. This layer is disposed in the recessed portions beforehand to cushion and absorb the high pressure from mold resin during the molding process, preventing the thin component cover from being damaged while maintaining the protective recesses
2Ease of manufacture
If the component cover is made thin in portions with recesses, then the mold resin can enter and fill spaces, but the component cover cannot withstand the high pressure of the mold resin
Solution Approach 1:
A cushioning layer is introduced as an intermediary between the component cover and the mounting substrate. This intermediary layer absorbs and distributes the high pressure from the mold resin, allowing the mold filling process to proceed while protecting the thin component cover from pressure damage. The cushioning layer acts as a mediator that enables both the thin-walled structure and the high-pressure molding process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the strength of the electronic component package against external pressures, preventing damage by buffering stress and reducing the amount of mold resin entering the package, thus improving reliability and durability.
Implementation Method 1
the protective member which receives a pressure that is applied from the lower side during a mold resin filling process can elastically deform so as to laterally disperse the pressure
Data Source
AI summary
In an electronic component package in which an electronic component mounted on a mounting substrate via external electrodes placed on the mounting substrate is covered by a mold resin, the electronic component has a component cover which covers elements placed on the lower face of a component substrate, and which forms cavities, and a protective member which is lower in elastic modulus than the mold resin is disposed in a portion which excludes portions joined with the external electrodes in a lower face of the component cover, and which is opposed to the cavities.