Composite Electronic Component Acoustic Noise Reduction
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Solution Overview
Problem
Multilayer ceramic capacitors generate acoustic noise due to piezoelectric phenomena when voltage is applied, causing vibrations that are transferred to printed circuit boards, leading to discomfort, and existing solutions have not effectively reduced this noise while maintaining low equivalent series resistance (ESR) and equivalent series inductance (ESL) and high capacitance.
Innovation Solution
A composite electronic component is created by coupling a multilayer ceramic capacitor with a tantalum capacitor, where the internal electrodes of the ceramic capacitor are designed to be led out to the surfaces, reducing ESR and ESL, and the capacitors are connected at a predetermined volume ratio to minimize acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the thickness of the lower cover layer of the multilayer ceramic capacitor is increased to decrease acoustic noise, then acoustic noise is reduced, but the chip thickness increases and ESR/ESL performance deteriorates
Solution Approach 1:
The patent combines a multilayer ceramic capacitor and a tantalum capacitor into a single composite component, where the ceramic capacitor handles high-frequency signals (low ESR/ESL) and the tantalum capacitor handles low-frequency signals (high capacitance), achieving both acoustic noise reduction and performance maintenance
Solution Approach 2:
The invention uses a composite structure integrating two different capacitor technologies (ceramic and tantalum) with complementary characteristics, where the ceramic portion provides low ESR/ESL and the tantalum portion provides high capacitance, resolving the contradiction between noise reduction and performance
2Reliability
If internal electrodes are led out to upper and lower surfaces and end surfaces of the ceramic body, then ESR and ESL are decreased, but manufacturing complexity increases
Solution Approach 1:
The patent extends internal electrodes from traditional two-dimensional surface mounting to three-dimensional exposure on multiple surfaces (upper, lower, and end surfaces), creating additional current paths that reduce ESR/ESL while the molding process manages the manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composite component effectively decreases acoustic noise, achieves low ESR and ESL, improves DC-bias characteristics, and reduces chip thickness, while maintaining high capacitance, thus providing a more effective solution than previous approaches.
Implementation Method 1
Since the dielectric layers as described above may have piezoelectric and electrostrictive properties, when a direct current (DC) or alternating current (AC) voltage is applied to a multilayer ceramic capacitor, a piezoelectric phenomenon may occur in the dielectric layers interposed between the internal electrodes, causing vibrations.
Implementation Method 2
Since the dielectric layers as described above may have piezoelectric and electrostrictive properties, when a direct current (DC) or alternating current (AC) voltage is applied to a multilayer ceramic capacitor, a piezoelectric phenomenon may occur in the dielectric layers interposed between the internal electrodes, causing vibrations.
Data Source
AI summary
A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction.