Printed Circuit Assembling TRIZ Cases

Branched bus bar terminals engage printed conductors to secure connections without external jigs.

Coupling a tantalum capacitor with a multilayer ceramic capacitor reduces acoustic noise while maintaining low ESR and ESL.

A separate control integrated circuit manages an active switch to prevent unauthorized access without modifying the existing RFID IC.

Corrects resin coating volumes using pre-measured light emitting data to resolve wavelength variation across LED elements.

Truncated pad corners at row ends distribute thermal cycling stress to extend rupture life without increasing overall manufacturing complexity.

Forming convex and concave stress relief structures on substrates before thinning prevents distortion and bending, ensuring reliable touch panel performance.

A process inspection device extracts features from intermediate products to compare against predetermined standards.

A clip element generates contact pressure between connectors to ensure secure electrical connection.

Replacing thick polymer layers with 6-micron PEEK films resolves the trade-off between electrical insulation and heat dissipation in insulated metal substrates.

Feeder detection units verify component presence at supply positions, preventing tact loss caused by pickup misses during board mounting.

A stiffener with higher hardness than the flexible printed circuit board improves structural strength and flatness for reliable soldering connections.

A chuck device uses a cylindrical cam to switch between multiple chuck claws for clamping components.

A light emitting device package uses a segmented electrode structure with an insulation layer to minimize light loss and prevent electrical shorts.

Adding specific Sn-Cu-Ni solder compositions before concentration shifts prevents fluidity loss and production stoppages in HASL baths.

Contactless solder paste dispensing creates precise micro-solder deposits on printed circuit board pads using a movable heating bar.

Grooves in the front resin layer absorb mechanical stress from shocks and temperature variations, preventing contact ball cracking without rear-side resin.

Segmented carrier elements reduce gold plating costs by localizing conductive contacts while vertical projections enable complex 3D geometries.

Laser-induced melting of an alloy adhesion layer bonds the light source unit to the slider, reducing thermal stress on magnetic head elements.

Protruding portions bend along intersecting lines to distribute stress, preventing open circuits and eliminating complex fixing structures.

A flexible substrate battery protection circuit package integrates surface mounting technology with lead frame terminals for external connections.

A viscous aqueous composition solidifies on complex surfaces to visually differentiate production residues and contaminants via color changes.

A solder mask with a common opening spanning multiple circuit elements confines molten solder during reflow to enable finer pitch interconnections.

A substrate layout with a peripheral trace rail and perpendicular traces connects power supply connections to the die area.

A screen printing stencil uses a fluorine-containing silane coupling agent to bond an amorphous carbon film.

Internal circuit patterns nest within insulating layers to boost wiring density without increasing substrate thickness.

Cut-in features overlap castellated contacts to reduce side wall conductor area, preventing sawing-induced delamination and improving solder joint reliability.

Asymmetric connection elements establish form fit to limit relative motion, resolving centering accuracy issues in high-density component carriers.

Sn-Zn solder paste incorporates Ag, Au, or Cu nanoparticles to refine the alloy structure during solidification.

Integrating isolation, placement, and laser heating into one device reduces handling time while maintaining positioning accuracy.

A conducting wire connects to battery power tabs via spot welding and wrapping to route current efficiently.

Shaped solder paste on conductive pads prevents bridges between adjacent components, improving yield and reliability.

Proximity suppressor prevents groove deformation during insertion, ensuring stable holding force and reduced assembly height.

Redundant flexible connectors link rigid PCB islands, preventing single-point failures from mechanical stress or moisture damage.

Flexible substrates maintain electrical conductivity during lens rotation, resolving stability versus movement trade-offs.

Metal oxalate solder paste decomposes into nanometric clusters to form homogeneous joints, resolving porosity and reactivity issues in power component assembly.

Relocating the bonding region to the base end-side reduces non-display width, resolving gaps in spliced screens while maintaining reliable signal transmission.

Relocating driving units to side surfaces reduces non-display area, increasing effective panel efficiency.

A metallization layer features a localized hardening area created by diffusing material into the metal foil to support ultrasonic welding forces.

Resin strip edge cutouts increase effective path length to slow liquid flow along flexible printed circuit boundaries.

Positioning features ensure coaxial fiber-chip alignment, reducing electromagnetic interference.

Micro-channels inject chemical substances to dissolve adhesives, preventing substrate warpage and ensuring complete adhesive removal during fabrication.

Curable dielectric sheets melt and flow to embed semiconductor devices, eliminating ceramic substrates that increase package thickness.

Exposed metal frame enables common mold usage, reducing fabrication cost and improving heat dissipation.

Inverted non-wettable transfer tools deposit solder paste onto non-planar circuit board pads, resolving positioning accuracy issues.

Compliant pins in edge launch RF connectors absorb axial misalignment, ensuring reliable signal transfer without solder points.

A socket element embeds into protective compound on a circuit board to secure sensors and plugs.

Alternating slot rows in the slotted area increase creepage distance while maintaining structural rigidity against flexing and cracking.

Ground conductors between signal vias mitigate electrical interference, enabling reliable operation at 18-30 GHz frequencies.

A pad structure uses a copper-tin intermetallic layer and gold top layer to suppress galvanic corrosion in via stacks.