Electrode Structure for Light Emitting Device Package
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Solution Overview
Problem
Current light emitting device packages face challenges in maximizing luminance and minimizing light loss due to structural limitations and inefficient electrical connections, which affect their reliability and performance in various applications.
Innovation Solution
The proposed light emitting device package incorporates a conductive support member with a protective member and an electrode structure that includes an upper portion on the semiconductor layer, a side portion extended along the side surface, and an extended portion on the protective member, along with an insulation layer to minimize light loss and prevent electrical shorts, and uses a socket for electrical connection instead of wires to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for electrical connection, then electrical connection is achieved, but reliability is reduced due to potential damage from wire bonding
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the electrical connection method. Instead of using wires to bond the semiconductor chip to the substrate, the invention uses direct pad-to-pad electrical connections where the chip pads are directly connected to the substrate pads through conductive structures, completely removing the harmful wire bonding step and its associated reliability issues
Solution Approach 2:
The patent replaces the mechanical wire bonding system with a direct electrical contact system. The mechanical process of wire bonding is substituted by a simpler electrical connection mechanism where conductive pads on the chip directly contact corresponding pads on the substrate, eliminating the need for wire manipulation and bonding machinery
2Loss of energy
If conventional electrode structure is used, then electrical connection is simple, but light loss increases due to structural limitations
Solution Approach 1:
The patent transitions from a conventional planar electrode structure to a three-dimensional electrode configuration. The electrode extends not only in the horizontal plane but also vertically along the side surfaces of the semiconductor chip, creating a multi-dimensional conductive network that efficiently collects current while minimizing light interference
Solution Approach 2:
The patent implements a nested electrode structure where the side surface electrode is positioned within the spatial envelope defined by the chip dimensions. The electrode structure is nested along the side surfaces and extends to the back surface, creating a compact, space-efficient configuration that maximizes electrical functionality without increasing overall device footprint
3Illumination intensity
If luminance is increased, then light output is improved, but light extraction efficiency is reduced due to structural limitations
Solution Approach 1:
The patent segments the electrode into multiple functional portions: an upper portion on the front surface, side portions along the vertical surfaces, and a back portion on the rear surface. This segmentation allows each electrode segment to be optimized for its specific function, with the side and back portions specifically designed to minimize light extraction interference while the front portion maintains electrical connection
Data Source
AI summary
Provided is a light emitting device, the light emitting device including: a support member (160); a light emitting structure (145) on the support member, the light emitting structure comprising a first conductive type semiconductor layer (130), a second conductive type semiconductor layer (150), and an active layer (140) between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a protective member (155) at a peripheral region of an upper surface of the support member; an electrode (128) including an upper portion being on the first conductive type semiconductor layer, a side portion extended from the upper portion and being on a side surface of the light emitting structure, and an extended portion extended from the side portion and being on the protective member; and an insulation layer (125) between the side surface of the light emitting structure and the electrode.