Non-Circular Connection Elements for Component Carrier Centering

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Solution Overview

Problem

Conventional component carriers face challenges in achieving accurate centering and high package densities during connection processes, leading to potential misalignment and reduced mechanical strength.

Innovation Solution

The implementation of a connection arrangement with first and second electrically conductive connection elements that establish a form fit along a connection direction, utilizing non-circular cross-sections and cooperating surfaces for enhanced centering, and incorporating solderable materials with dimples to facilitate reliable soldering and mechanical support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional pads and vias are used for connection, then the connection arrangement can be formed, but accurate centering between connection partners is difficult to achieve

Engineering Contradiction:
Improvecentering accuracyVSAvoidalignment precision
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The connection elements are designed with non-circular cross-sections (e.g., rectangular, triangular, or other asymmetric shapes) instead of conventional circular pads and vias. This asymmetric geometry creates inherent directional guidance that enables accurate centering between connection partners during the assembly process, directly resolving the centering accuracy issue.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The form fit between connection elements is established before the final soldering or bonding operation. The non-circular cross-sections create mechanical guidance that pre-aligns the connection partners, ensuring accurate centering is achieved prior to the irreversible bonding step, thereby improving both measurement and manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

2Productivity

If conventional circular pads and vias are used, then the connection can be formed, but high package densities cannot be achieved

Engineering Contradiction:
Improvepackage densityVSAvoidalignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

By using non-circular cross-sections for connection elements, the design enables more efficient space utilization and tighter packing arrangements. The asymmetric shapes allow for optimized routing and reduced spacing requirements between adjacent connections, directly enabling higher package densities while maintaining alignment precision through the inherent geometric guidance.

Inventive Principle:
Principle #4Asymmetry

3Strength

If connection elements are connected without form fit, then the connection process is simpler, but mechanical strength is reduced

Engineering Contradiction:
Improvemechanical strengthVSAvoidconnection structure complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The non-circular cross-sections of the connection elements create a form fit mechanism that provides enhanced mechanical strength through geometric interlocking. The asymmetric shape prevents lateral displacement and improves bonding surface contact, thereby increasing mechanical strength without requiring additional complex structural features or attachment mechanisms.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS11658142B2Connection arrangement, component carrier and method of forming a component carrier structure
Publication Date: 2023.05.23 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG
  • US11658142B2 patent drawing
  • US11658142B2 patent drawing
  • US11658142B2 patent drawing

AI summary

A connection arrangement for forming a component carrier structure is disclosed. The connection arrangement includes a first electrically conductive connection element and a second electrically conductive connection element. The first connection element and the second connection element are configured such that, upon connecting the first connection element with the second connection element along a connection direction, a form fit is established between the first connection element and the second connection element that limits a relative motion between the first connection element and the second connection element in a plane perpendicular to the connection direction. A component carrier and a method of forming a component carrier structure are also disclosed.