Micro-Solder Depot Formation via Contactless Paste Dispensing
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Solution Overview
Problem
The increasing miniaturization of SMD components leads to precision challenges in applying solder paste, resulting in issues like solder bridges and beads due to large initial quantities required, which are costly and complex to manage with existing mask or foil-based methods, especially when integrating micro-solder depots with larger components.
Innovation Solution
A method using a bracket soldering process to produce micro-solder depots with precise height control, where solder paste is applied contactlessly and melted using a movable bar, eliminating the need for initial large quantities and mechanical application methods, allowing for precise placement and reduced residue with water-soluble flux.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If screen or mask printing process is used to apply solder paste, then solder paste can be applied to pads, but large quantities of solder paste are required leading to solder bridges and beads
Solution Approach 1:
The invention extracts the harmful excess solder paste from the system by using a dispensing device that applies only the precise amount of solder paste needed on each pad, eliminating the large quantities required by screen printing that cause solder bridges and beads
Solution Approach 2:
The invention replaces the mechanical screen printing process with a dispensing device that uses controlled material flow to deposit solder paste, substituting the mechanical mask-based system with a more precise delivery mechanism that prevents excess paste application
2Manufacturing precision
If special stencils and high-quality solder pastes are used to avoid solder bridges, then soldering quality improves, but manufacturing cost and time increase
Solution Approach 1:
The invention replaces complex special stencils and high-quality solder paste requirements with a dispensing device that achieves precise solder paste application through controlled delivery, eliminating the need for expensive specialized materials and tools
Solution Approach 2:
The invention changes the critical parameter from solder paste quality and stencil complexity to dispensing precision and material flow control, allowing standard solder paste to be used with ordinary stencils while achieving high soldering quality through improved application control
3Manufacturing precision
If mask or film-based processes are used to create micro solder deposits, then micro solder deposits can be formed, but interaction with larger components becomes problematic during subsequent soldering
Solution Approach 1:
The invention extracts the temporary mask or film from the process, forming micro solder deposits directly on the pads through controlled dispensing, eliminating the need for mask-based processes that interfere with subsequent soldering of larger components
Solution Approach 2:
The invention performs preliminary formation of micro solder deposits on pads before assembling larger components, using a dispensing device to create precisely controlled solder deposits that do not require subsequent mask removal or adjustment when larger components are soldered
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes defects like solder bridges and beads, enables precise micro-solder depot formation, and facilitates efficient assembly of both micro-SMD and larger components without the need for extensive solder paste application, improving production efficiency and reducing costs.
Implementation Method 1
Reaching a predetermined soldering temperature (Lt) by means of an electric current flowing through the bar
Implementation Method 2
a predetermined soldering temperature (Lt) is reached by means of an electric current flowing through the bar
Implementation Method 3
at the predetermined soldering temperature the solder paste applied to the contact surface is soldered to the solderable contact surface
Data Source
Figure 1a~1c
Figure 2a~3
AI summary
The invention relates to a method for manufacturing a printed circuit board (1) with at least one micro-solder deposit (2; 2a; 2b; 2c,...) soldered onto it, comprising the steps of: - applying solder paste (3) to at least one solderable contact surface (4; 4a; 4b; 4c) arranged on a surface of a printed circuit board (1); - subsequently melting the solder paste (3), in particular soldering the solder paste (3) to the solderable contact surface (4; 4a; 4b; 4c) in a soldering process, thereby creating the micro-solder deposit (2; 2a; 2b; 2c,...). The invention further relates to a printed circuit board manufactured using the method according to the invention.