Electronic Package Metal Frame Common Mold Cost Reduction
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Solution Overview
Problem
Conventional semiconductor package structures face high fabrication costs due to the need for molds of specific sizes and poor heat dissipation caused by encapsulation of semiconductor and passive elements, which limits their applicability and performance.
Innovation Solution
An electronic package structure comprising a carrier with electronic components, conductive elements, and a metal frame with conductive pads, where the metal frame is bonded to the conductive elements and exposed from the encapsulant to serve as an electrical contact, allowing for the use of a common mold and improved heat dissipation through a board integrated with the metal frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the molding range of the encapsulant is reduced to expose the I/O pads, then the I/O pads are accessible for mounting, but a mold of particular size is required which increases fabrication cost
Solution Approach 1:
The metal frame structure serves multiple functions: it provides the mounting surface for solder balls, acts as an electrical connection component, and serves as a structural support. This multi-functionality eliminates the need for a specially sized mold, allowing a common mold to be used for various package sizes, thereby reducing fabrication costs while maintaining I/O pad accessibility
2Reliability
If semiconductor elements and passive elements are encapsulated by the encapsulant, then the components are protected, but the heat dissipating effect deteriorates
Solution Approach 1:
The metal frame acts as an intermediary thermal conduction path between the semiconductor elements and the external environment. It provides a dedicated heat dissipation channel that does not interfere with the protective encapsulation, allowing heat to be efficiently conducted away from the components while they remain enclosed for protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces fabrication costs by enabling the use of a common mold and enhances heat dissipation, addressing the limitations of conventional semiconductor package structures.
Implementation Method 1
a plurality of conductive elements disposed on the carrier; a metal frame having a plurality of conductive pads bonded to the conductive elements
Implementation Method 2
the board of the metal frame facilitates to improve the heat dissipating effect of the electronic package structure
Implementation Method 3
an encapsulant formed on the carrier and/or the metal frame and encapsulating the electronic component and/or the conductive elements
Implementation Method 4
a plurality of solder balls disposed on the I/O pads, thus allowing an electronic device such as a circuit board to be mounted on the semiconductor package structure
Data Source
AI summary
An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.