Integrated Solder Ball Contacting Device with Laser Thermal Connection
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Solution Overview
Problem
The existing solder ball contacting method requires multiple devices and complex adjustments for isolating, placing, and thermally connecting solder balls, leading to inefficiencies in time and handling.
Innovation Solution
A method and device where contact mouthpieces pick up solder balls from a reservoir, place them on contact points, and apply laser energy for thermal connection, eliminating the need for separate devices and simplifying the process by using vacuum and ultrasound for uniform distribution and coating with a flow agent for improved joint quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple separate devices are used for isolating, placing, and thermally connecting solder balls, then each function can be performed with dedicated equipment, but the device complexity and handling time increase significantly
Solution Approach 1:
The patent combines multiple separate devices (isolation device, placement device, and thermal connection device) into a single integrated contacting device. The contacting device includes contact mouthpieces that can isolate solder balls, place them on contact points, and deliver laser energy for thermal connection, thereby reducing device complexity while maintaining all necessary functions
Solution Approach 2:
The contacting device is designed with multi-functionality, where the same contact mouthpieces perform multiple operations: picking up solder balls from the reservoir, placing them on contact points, and serving as conduits for laser energy delivery. This universal design eliminates the need for separate dedicated equipment for each function
2Reliability
If multiple separate devices and adjustment steps are used for solder ball contacting, then each operation can be optimized independently, but the handling time and process complexity increase
Solution Approach 1:
The patent merges isolation, placement, and thermal connection operations into a single integrated process using one contacting device. This eliminates the time-consuming transfer and adjustment steps between multiple separate devices, significantly reducing handling time while maintaining operation quality through the device's integrated design
Solution Approach 2:
The contact mouthpieces are pre-configured with vacuum channels and laser energy conduits, allowing them to perform multiple functions without intermediate adjustments. The device is prepared in advance to handle the entire solder ball contacting process in one operation, eliminating time-consuming setup and repositioning steps
3Measurement precision
If separate alignment adjustments are required between connecting device and solder balls, then positioning accuracy can be optimized, but the adjustment time and process complexity increase
Solution Approach 1:
The contacting device integrates the positioning and energy delivery functions, with contact mouthpieces that are pre-aligned to both place solder balls accurately and deliver laser energy to the correct positions. This eliminates the need for separate alignment adjustments between different devices, reducing adjustment time while maintaining positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies and accelerates the solder ball contacting process, reducing handling time and improving connection quality by integrating functions into a single device with adjustable alignment and quality assurance through laser positioning checks.
Implementation Method 1
the contact mouthpieces picking up the solder balls from the solder ball reservoir
Implementation Method 2
the solder ball reservoir be exposed to ultrasound while picking up the solder balls from the solder ball reservoir, so as to achieve a statistically uniform distribution density of the solder balls in the reservoir on the one hand, and cause the solder balls to jump up in response to ultrasound oscillations on the other hand
Implementation Method 3
the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points
Implementation Method 4
subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points
Data Source
AI summary
The invention relates to a method and a device for contacting a solder ball formation, in which a plurality of contact mouthpieces arranged in a formation is used to pick up a solder ball formation with a composition reflecting the relative arrangement of the contact mouthpieces from a solder ball reservoir comprising a multitude of randomly distributed solder balls, the solder ball formation is placed on contact points by means of the contact mouthpieces for subsequently contacting, and subsequently the solder balls are impinged with laser energy by means of the contact mouthpieces for thermal connection with the contact points.