Socket Element Embedded in Protective Compound for Sensor Mounting
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Solution Overview
Problem
Conventional electronic modules face challenges in reliably and stably attaching sensors and plugs to printed circuit boards, especially under mechanical stress, and require complex design changes which are time-consuming and inefficient due to fixed component positions and fastening methods.
Innovation Solution
An electronic module design where a base element is embedded in a protective compound on the printed circuit board, allowing sensors or plugs to be attached via this element, which is partially embedded but has a protruding surface for easy access and adjustment, enabling secure mechanical and electrical connections using methods like soldering or welding, and encapsulation for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional soldered connections are used to attach sensors and connectors to the printed circuit board, then electrical connections are established, but mechanical failure risk increases under significant forces during operation
Solution Approach 1:
The invention separates the electrical connection function (performed by soldered contacts on the circuit board) from the mechanical support function (performed by the housing and mounting structure). This segmentation allows each function to be optimized independently, preventing mechanical stress from being transmitted to the fragile soldered electrical connections.
Solution Approach 2:
The patent introduces an intermediary mounting structure (flange with guide plate) that acts as a mediator between the sensor and the circuit board. This intermediary absorbs and distributes mechanical forces, protecting the direct electrical connection paths while maintaining both mechanical strength and electrical connectivity.
2Strength
If fixed fastening methods like screws or rivets are used to attach sensors to the printed circuit board, then mechanical strength is improved, but design changes become time-consuming and complex
Solution Approach 1:
The invention employs a dynamic mounting approach where the sensor can be positioned and attached after the housing is assembled. The flange structure with guide plate provides a flexible mounting interface that accommodates design changes without requiring redesign of the entire housing or circuit board, enabling rapid prototyping and iteration.
Solution Approach 2:
The housing and flange structure are pre-assembled with the electrical connection infrastructure in place before the sensor is mounted. This preliminary preparation creates a standardized interface that simplifies subsequent sensor attachment and facilitates easy design modifications by simply changing the sensor component rather than the entire assembly.
3Ease of operation
If sensors and connectors are positioned to be accessible from the outside, then functionality is improved, but mechanical protection is reduced
Solution Approach 1:
The patent implements a nested structure where the sensor is mounted on the flange, which is attached to the housing, creating concentric protective layers. The housing provides the outer protective shell while the flange creates an intermediate protective barrier, allowing the sensor to remain accessible from the outside while being progressively protected by multiple structural layers.
Solution Approach 2:
The invention applies differential protection strategies to different components: the housing provides environmental protection for the circuit board and internal electronics, while the flange and guide plate provide localized protection and alignment for the sensor. This local quality approach ensures each component receives appropriate protection based on its specific functional requirements.
Data Source
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AI summary
The invention relates to an electronic module (1) and a method for producing same. The electronic module has a circuit board (3), at least one first component (5), and a socket element (7) which has a first surface (6) and a second surface (8) opposite the first surface and the first surface (6) of which lies on a surface of the circuit board (3) and is fixed to the circuit board. The electronic module has a second component (9) which is secured to the socket element (7) and is electrically connected to the circuit board (3) via the socket element. Furthermore, a protective compound (11) is provided which is arranged on the surface of the circuit board (3) and encapsulates the first component (5). The electronic module (1) is characterized in that the socket element (7) is partly embedded into the protective compound (11) such that lateral flanks (10) of the socket element (7) are covered by the protective compound (11), and the second surface (8) of the socket element (7) protrudes out of the protective compound (11) in an exposed manner. Connection elements (19) of the socket element (7) and connections (17) of the second component (9) can be connected preferably via a welding connection (17) and can be encapsulated by a protective compound (21) or a cover. Second components (9), such as sensors or plugs for example, can thereby be attached to the circuit board (3) in a mechanically secured and electrically reliable manner. Because standard components and standard assembly methods can be used, changes to the design of the electronic module can be implemented easily and quickly.