Flexible Device Fabrication via Chemical Peel Channels
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Solution Overview
Problem
The existing methods for fabricating flexible electronic devices face challenges such as substrate deformation, warpage, and incomplete adhesive removal during the peeling process from rigid substrates, making it difficult to produce high-quality flexible devices.
Innovation Solution
The method involves providing channels on a rigid substrate with injection ports for a chemical substance to react with the adhesive, allowing for complete and controlled peeling of the flexible substrate without damaging it, using micro-channels, patterns, or grooves on the substrate to facilitate the chemical reaction and peeling process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heating or laser melt-cutting method is used to peel the flexible substrate from the rigid substrate, then the peeling effect is improved to some extent, but the adhesive cannot be completely peeled off and the flexible substrate is damaged
Solution Approach 1:
The patent extracts the adhesive removal function from the peeling process by introducing chemical substances through channels. The channels are specifically designed to deliver chemical agents that selectively dissolve or react with the adhesive, separating the adhesive removal function from the mechanical peeling action. This allows the flexible substrate to be peeled off cleanly without adhesive residue while preventing substrate damage.
Solution Approach 2:
The patent introduces chemical substances as intermediaries between the peeling process and the adhesive. These chemical substances (such as solvents or reactive agents) act as mediators that facilitate adhesive removal through chemical reactions or dissolution, rather than relying solely on mechanical or thermal forces that can damage the flexible substrate.
2Reliability
If heating or laser melt-cutting method is used to peel the flexible substrate from the rigid substrate, then the peeling effect is improved to some extent, but the peeling process conditions are difficult to control
Solution Approach 1:
The patent segments the adhesive removal process by distributing multiple channels across the rigid substrate. Each channel can be independently controlled to deliver chemical substances to specific regions. This segmentation allows for localized and controlled adhesive removal, making the overall process easier to control compared to uniform heating or laser treatment of the entire substrate.
Solution Approach 2:
The patent replaces the mechanical/thermal peeling system (heating or laser melt-cutting) with a chemical system. Instead of using high temperatures or intense laser energy that are difficult to control, the patent uses chemical substances delivered through channels, which offer more precise and controllable adhesive removal with milder conditions that prevent substrate damage.
3Strength
If adhesive is used to adhere the flexible substrate to the rigid substrate, then the substrate can be held firmly, but the adhesive causes deformation or warpage phenomenon during fabricating the electronic device
Solution Approach 1:
The patent extracts the adhesive from the interface between the flexible and rigid substrates by providing channels on the rigid substrate. The channels allow chemical substances to react with and remove the adhesive, completely eliminating it from the system. This extraction resolves the contradiction by removing the source of warpage while maintaining the ability to firmly hold substrates during fabrication through the channel structure itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures the flexible substrate is not deformed and allows for complete adhesive removal, enhancing the peeling efficiency and quality of the flexible electronic device production.
Implementation Method 1
reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate
Data Source
AI summary
A method for fabricating a flexible electronic device, including the steps of: providing channels on a rigid substrate; adhering a flexible substrate to the rigid substrate with an adhesive; fabricating an electronic device on the flexible substrate; injecting a chemical substance into the channels; and reacting the chemical substance with the adhesive and peeling the flexible substrate from the rigid substrate. The rigid substrate comprises a first surface, a second surface opposite the first surface, and a side wall extending between the first surface and the second surface. The channels are provided on the first surface of the rigid substrate. The channels are in communication with an injection port, the injection port is located on the side wall of the rigid substrate, and a portion of the side wall is located between the injection port and the first surface.