Surface-Mounted Component Grooved Resin Layer for Shock Resistance
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Solution Overview
Problem
Surface-mounted electronic components face issues with brittleness of contact balls leading to malfunctions due to shocks and warpage caused by temperature variations, primarily due to differences in thermal expansion coefficients between materials.
Innovation Solution
A surface-mounted electronic component with a rigid protective resin layer on its front surface, where grooves are formed between the balls to reduce mechanical stress and accommodate thermal expansion differences, eliminating the need for an additional resin layer on the rear surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact balls are made larger to increase connection reliability, then bonding strength is improved, but the number of connections that can be formed on a given chip area decreases
Solution Approach 1:
The chip surface is segmented into distinct regions: a central active area for high-density ball connections and a peripheral resin extension area for additional connections. This segmentation allows optimization of ball size and density in different zones, achieving both high connection reliability and maximum area utilization.
Solution Approach 2:
The solution transitions from a two-dimensional planar chip surface to a three-dimensional structure by adding a peripheral resin extension that protrudes from the chip surface. This dimensional change provides additional space for contact balls without increasing the chip's footprint area.
2Object-affected harmful factors
If a rigid protective resin layer is formed on the front surface to protect contact balls from shocks, then shock resistance is improved, but thermal expansion differences cause warpage
Solution Approach 1:
The resin layer thickness is varied locally: it is thinner in the central area where contact balls are located ( providing protection without excessive constraint) and thicker in the peripheral extension area (providing structural support and shock absorption). This local quality variation balances protection needs with thermal expansion accommodation.
Solution Approach 2:
The resin layer thickness parameter is optimized to be between 40-70 micrometers, which is sufficient to protect contact balls from shocks but thin enough to minimize warpage caused by thermal expansion differences. This parameter change resolves the contradiction between protection and stability.
3Object-affected harmful factors
If grooves are added to the resin layer to reduce mechanical stress on contact balls, then shock resistance is improved, but manufacturing complexity increases
Solution Approach 1:
The groove formation step is merged with the existing resin layer deposition process. Grooves are formed in the resin layer using the same dicing or laser tools already employed for chip fabrication, combining multiple functions into a single manufacturing step and minimizing additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The component exhibits improved resistance to shocks and temperature variations, reducing the likelihood of ball cracking and warpage, while simplifying the manufacturing process by integrating grooves into the resin layer.
Implementation Method 1
temperature variations, primarily due to differences in thermal expansion coefficients between materials
Implementation Method 2
improved resistance to shocks and temperature variations, reducing the likelihood of ball cracking
Data Source
AI summary
A surface-mounted electronic component including balls bonded to its front surface and, on the front surface, a protective resin layer having a thickness smaller than the ball height, wherein grooves extend in the resin layer between balls of the chip.