Solder Paste Pattern for Preventing Bridges in Electronic Packages
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Solution Overview
Problem
In electronic packages, the risk of solder bridges forming between adjacent components during the soldering process leads to undesired electrical connections and potential short-circuits, reducing yield due to the close layout and flow of solder pastes beyond their original areas.
Innovation Solution
A method involving a substrate with conductive pads where solder paste is applied in a specific shape that exposes a portion of the pad's surface away from adjacent pads, ensuring alignment and reflow to secure components without excessive paste flow, thereby preventing solder bridges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a tight layout is implemented to accommodate electronic components in limited space, then the area utilization is improved, but the risk of solder bridge formation increases
Solution Approach 1:
The solder paste is designed with non-uniform distribution featuring a paste body portion and an extended portion. The extended portion specifically targets the inner side of the conductive pad adjacent to neighboring pads, creating localized quality variation that prevents solder bridge formation while maintaining tight layout benefits
Solution Approach 2:
The solder paste pattern is pre-configured with an extended portion that proactively occupies the space between adjacent conductive pads before soldering. This preliminary action prevents solder material from flowing into the gap between pads during the reflow process, thereby preventing solder bridge formation in advance
2Reliability
If solder paste is applied to cover the entire conductive pad surface, then the electrical connection reliability is improved, but the solder paste flows beyond the pad area during reflow causing solder bridges
Solution Approach 1:
The solder paste distribution is made non-uniform with different portions serving different functions: the paste body portion ensures reliable electrical connection by covering the main conductive pad area, while the extended portion specifically prevents solder bridge formation by occupying the inter-pad space
Solution Approach 2:
The solder paste pattern is segmented into distinct functional portions: a paste body portion for electrical connection and an extended portion for preventing solder bridges. This segmentation allows each portion to optimize its specific function without compromising the other
3Volume of moving object
If electronic components are placed very close to each other, then the device size is reduced, but the manufacturing precision requirement increases to avoid solder bridges
Solution Approach 1:
The extended portion of the solder paste is pre-applied to occupy the inter-pad space before component placement and reflow. This preliminary action reduces the precision requirement for component placement by creating a physical barrier that prevents solder bridge formation even with minor positioning variations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces the risk of solder bridges, ensuring reliable electrical connections and preventing short-circuits, thereby improving the yield and performance of electronic packages.
Implementation Method 1
reflowing the solder paste on the first set of conductive pads to secure the first electronic component onto the substrate
Data Source
AI summary
Provided is a method for forming an electronic package, comprising: providing a substrate comprising a first set of conductive pads at which a set of terminals of a first electronic component are to be mounted, respectively; forming solder paste on each of the first set of conductive pads, wherein the solder paste exposes a portion of a surface of a conductive pad that is facing away from the others of the first set of conductive pads but does not substantially expose another portion of the surface of the conductive pad that is facing towards the others of the first set of conductive pads; placing the first electronic component on the substrate with the set of terminals of the first electronic component aligned with the first set of conductive pads; reflowing the solder paste on the first set of conductive pads to secure the first electronic component onto the substrate.