Composite Carrier Layering to Cut CMP Steps in Packaging
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Solution Overview
Problem
Conventional carriers used in integrated circuit packaging require multiple CMP processes due to their multi-layered structure of different materials, leading to high manufacturing costs.
Innovation Solution
A composite carrier is formed with layers made of similar materials, allowing them to be removed in the same CMP process, reducing the number of required CMP processes from five to three.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional multi-layered carriers with different materials are used, then the carrier can provide diverse functional properties, but the number of CMP processes increases and manufacturing cost rises
Solution Approach 1:
The patent applies homogeneity by forming the second, third, and fourth layers from the same material (e.g., silicon oxide). This allows these three layers to be removed in a single CMP process, reducing the total CMP processes from five to three while maintaining the multi-layer functional structure during manufacturing
Solution Approach 2:
The carrier structure is segmented into distinct functional layers: base carrier layer (first layer), intermediate layers (second, third, fourth layers made of same material), and bond layer (fifth layer). This segmentation allows each layer to serve specific functions while enabling efficient batch removal of intermediate layers
2Manufacturing precision
If five separate CMP processes are performed for each carrier layer, then complete carrier removal is achieved, but manufacturing time and cost increase
Solution Approach 1:
The patent merges the removal of the second, third, and fourth layers into a single CMP process. Since these layers are made of the same material, they can be removed together in one operation, reducing the total number of CMP processes from five to three without compromising complete carrier removal
Solution Approach 2:
The invention changes the material parameter of multiple layers to be identical (e.g., all silicon oxide), which enables them to respond uniformly to the same CMP process conditions, allowing batch removal in a single process step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces manufacturing costs by simplifying the CMP process, while maintaining effective removal of carrier layers and ensuring compatibility with subsequent packaging processes.
Implementation Method 1
A process for forming a package using the composite carrier is also illustrated. In accordance with some embodiments, three Chemical Mechanical Polish (CMP) processes are performed, with the first CMP process, the second CMP process, and the third CMP process used to remove the silicon carrier, the first layer, and the second plurality of layers, respectively.
Data Source
AI summary
A method includes bonding a first package component on a composite carrier, and performing a first polishing process on the composite carrier to remove a base carrier of the composite carrier. The first polishing process stops on a first layer of the composite carrier. A second polishing process is performed to remove the first layer of the composite carrier. The second polishing process stops on a second layer of the composite carrier. A third polishing process is performed to remove a plurality of layers in the composite carrier. The plurality of layers include the second layer, and the third polishing process stops on a dielectric layer in the first package component.