Composite Ceramic Substrate with Resin Leg for Bending Adaptation

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Solution Overview

Problem

Conventional composite ceramic substrates face issues with wire breakage and detachment from motherboards due to bending, as well as damage to surface-mounted components, when surface-mounted components cannot adapt to the bending of the ceramic substrate, leading to disconnection and breakage of wires.

Innovation Solution

A composite ceramic substrate design featuring a ceramic substrate with surface-mounted components, external terminal electrodes connected via a convex leg portion made of resin with via-hole conductors, which allows the substrate to bend with the motherboard, preventing disconnection and damage by supporting the external terminal electrodes and connecting them to the wiring pattern.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a recess is formed at the central portion of the laminate to avoid pressing-up force from motherboard bending, then detachment and breakage of the laminate are prevented, but the entire laminate bends corresponding to bending of the printed-circuit board causing disconnection of terminals and wire breakage when surface-mounted components are mounted

Engineering Contradiction:

Improveresistance to pressing-up forceVSAvoidconnection reliability of surface-mounted components

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The laminate is divided into a rigid central portion and flexible side portions. The recess is positioned to create a rigid support area at the center while allowing the side portions to remain flexible and bend with the motherboard, thus preventing both pressing-up force damage and wire breakage from bending.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the laminate are given different mechanical properties. The central portion with the recess maintains rigidity to resist pressing-up force, while the side portions away from the recess maintain flexibility to bend with the motherboard without causing wire breakage.

Inventive Principle:

Principle #3Local quality

2Productivity

If surface-mounted components are mounted on the ceramic substrate to decrease board component size, then mounting density is improved, but the ceramic substrate bends causing disconnection of terminals and wire breakage

Engineering Contradiction:

Improvemounting densityVSAvoidconnection reliability of surface-mounted components

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The ceramic substrate is segmented into a rigid central mounting area and flexible side areas. Surface-mounted components are mounted on the rigid central portion where they remain stable during bending, preventing disconnection and wire breakage while maintaining high mounting density.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The ceramic substrate has different mechanical characteristics in different regions. The central portion where components are mounted maintains rigidity to prevent component disconnection, while the side portions remain flexible to bend with the motherboard without causing wire breakage.

Inventive Principle:

Principle #3Local quality

3Stability of the object's composition

If the laminate structure is made rigid to prevent bending, then structural stability is improved, but the laminate cannot adapt to motherboard bending causing wire breakage and detachment

Engineering Contradiction:

Improvestructural stability of laminateVSAvoidadaptability to motherboard bending

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The laminate structure is segmented into rigid and flexible zones. The rigid central portion with the recess provides structural stability and maintains composition integrity, while the flexible side portions adapt to motherboard bending movements without causing wire breakage or detachment.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the laminate have different mechanical properties tailored to their functions. The central region maintains rigidity for structural stability, while the peripheral regions have flexibility to adapt to motherboard bending, thus resolving the contradiction between stability and adaptability.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS7820916B2Composite ceramic substrate

Publication Date: 2010.10.26 MURATA MFG CO LTD

AI summary

A composite ceramic substrate includes a ceramic substrate having surface-mounted components mounted thereon, external terminal electrodes connecting wiring patterns disposed on the ceramic substrate and surface electrodes of a motherboard, and a convex leg portion made of resin and arranged such that an end surface supports the external terminal electrodes, and the external terminal electrodes are connected to the wiring patterns via a via-hole conductor provided in the leg portion.