Printed Electric Component Incorporation TRIZ Cases

Elastic deformation in bent metal plate connection members reduces thermal and shock stresses at composite substrate joints, improving connection reliability.

A fan out build up substrate stackable package integrates a circuit pattern within a buildup dielectric layer to enable direct metal layer connections.

Multi-material aerosol jet printing mixes polymer and ceramic streams in real-time to create functionally graded components.

Alternating selection lines connect to terminals between unit substrates, reducing manufacturing complexity while maintaining connection reliability.

Divided substrate electrodes enable selective solder coupling to switch connection sections without altering chip circuits.

A flip chip mounting method uses electrode pads with varying solder melting points to enable self-alignment of semiconductor components.

Interpenetrating polymer structures replace adhesives to prevent delamination under thermal stress.

A wireless IC device uses a ground electrode as an antenna to radiate signals, eliminating dedicated antennas and reducing size.

Partitioned cavities with adhesive mounting eliminate temporary tapes, ensuring uniform insulating layer thickness and consistent via hole depths.

Thicker outer metal foil enhances connection reliability and flatness while thin inner layers preserve wiring density and reduce board thickness.

Segmenting the laminate into rigid and flexible zones allows the substrate to bend with the motherboard without breaking wires.

Diagonal grid arrays in the layout circuit reduce noise interference while maintaining signal paths, lowering manufacturing costs.

Acidic electroplating followed by alkaline dip restores adhesion while maintaining fast deposition rates for electrical components.

A micro-castellated interposer enables automated assembly of disparate components on existing printed wiring boards.

Insulating layer extends continuously from insulating board to wiring sub board.

Retracting external connection pads reduces resin-induced thermal stress, preventing crack propagation into insulating layers.

An integrated circuit board positions antennas on edge areas separated from central electronic components to reduce signal loss and cable requirements.

Radial internal layer conductors coupled via connection vias transfer heat from surface electrodes into the substrate.

A panel circuit structure positions test pads outside the driving element projection area to reduce component size.

Hole portions in the flexible base member route second wires through connection members, maintaining electrical reliability while the substrate warps.

Automated lamination system deposits conductive patterns on prepreg layers before curing to embed electronic elements with high placement accuracy.