Composite Substrate Connection Members for Thermal Stress Reduction

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Solution Overview

Problem

Existing composite substrates face challenges in reducing thermal stress and shock stress at connection portions, leading to decreased connection reliability, especially when used in severe environments with differing coefficients of thermal expansion between the substrate body and the circuit substrate, and are complicated in structure and difficult to accurately connect.

Innovation Solution

A composite substrate with a frame member made of insulating material and connection members formed by bending thin metal plates, featuring a through-hole and strips that reduce thermal and shock stresses through elastic deformation, increasing connection reliability by simplifying the structure and improving package density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a frame member or package is attached to the substrate body to raise it from another circuit substrate, then the substrate body can be electrically connected to another circuit substrate, but thermal stress and shock stress increase due to different coefficients of thermal expansion, decreasing connection reliability

Engineering Contradiction:
Improveconnection reliabilityVSAvoidthermal stress and shock stress
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The connection member is designed with a specific structure including a first strip connected to the substrate body, a second strip connected to the frame member, and a middle strip connecting the first and second strips. This structural configuration allows the connection member to accommodate thermal expansion differences and shock stresses through elastic deformation, reducing stress concentration at connection points and improving connection reliability under thermal and mechanical stress

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The connection member is designed to be flexible rather than rigid, allowing it to dynamically adjust to thermal expansion and contraction as well as shock loads. The strip configuration enables the connection member to bend and absorb stress, transforming the static connection into a dynamic one that can adapt to environmental changes

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If the module component is used in a severe environment, then the application range is expanded, but the thermal stress and shock stress increase, significantly decreasing the connection reliability

Engineering Contradiction:
Improveapplication rangeVSAvoidconnection reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The connection member's strip structure is specifically designed to change its mechanical properties under stress, allowing it to flex and absorb thermal and shock stresses. This enables the module to be used in severe environments while maintaining connection reliability, as the connection member can adapt to extreme temperature variations and mechanical shocks

Inventive Principle:
Principle #35Parameter changes

3Ease of operation

If a lead terminal protrudes from the housing to connect module substrates, then the connection function is achieved, but the structure becomes complicated and accurate connection becomes difficult

Engineering Contradiction:
Improveconnection accuracyVSAvoidstructure complexity
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The connection member integrates multiple functions into a single component: it provides electrical connection between the substrate body and frame member, offers mechanical support, and absorbs thermal and shock stresses. This unified structure eliminates the need for separate connection elements, simplifying the overall structure while improving connection accuracy and reliability

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces thermal and shock stresses at connection points, enhancing the reliability and stability of the composite substrate by using a simple structure that allows for efficient manufacturing and increased package density, while preventing damage from thermal and shock stresses.

Implementation Method 1

the connection members are formed by bending thin metal plates so as to have a first strip and second strip continuously connected to either end of a middle strip... the first and second strips extend in a direction in which the connection members face each other with the through-hole therebetween... to reduce thermal and shock stresses through elastic deformation

Methodology Applied
Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS7851708B2Composite substrate and method for manufacturing composite substrate
Publication Date: 2010.12.14 MURATA MFG CO LTD
  • US7851708B2 patent drawing
  • US7851708B2 patent drawing
  • US7851708B2 patent drawing

AI summary

In a composite body, a frame body includes a frame member and a plurality of connection members formed by bending thin metal plates. The frame member includes a through-hole and extends along a peripheral portion of a substrate body. Each of the plurality of connection members has a first strip and a second strip continuously connected to opposed ends of a middle strip. The connection members are disposed in the frame member. Each of the first and second strips of the connection member is exposed on a major surface extending around the through-hole. The first strip and the second strip extend in a direction in which the connection members face each other, and opposed ends of the middle strip are continuously connected to the first strip and the second strip on the side adjacent to the through-hole. The middle strip extends through the inside of the frame member.