Wiring Substrate Electrode Segmentation for Flip-Chip Connection Flexibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor devices with flip-chip bonding, the sections coupled with solder cannot be easily changed, leading to inefficiencies as multiple chip and wiring substrate combinations are required for different circuit types, necessitating a method to switch electrode connections without altering chip or substrate circuits.
Innovation Solution
An electronic device configuration featuring a wiring substrate with specific electrodes divided into multiple portions, each coupled to different wirings, allowing for selective solder coupling with corresponding second electrodes, enabling switching of electrode connections without changing chip or substrate circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip-chip bonding is used to couple chip and wiring substrate with solder, then connection strength and reliability are improved, but adaptability deteriorates because sections to be coupled cannot be easily changed
Solution Approach 1:
The first electrode on the wiring substrate is divided into multiple divided portions (first divided portion and second divided portion), each coupled to different wirings. This segmentation allows selective solder coupling with different portions of the electrode, enabling switching of connection sections while maintaining strong solder bonds, thus resolving the contradiction between connection reliability and adaptability.
2Adaptability or versatility
If multiple chip and wiring substrate combinations are prepared for different circuit types, then adaptability is improved, but device complexity and manufacturing efficiency deteriorate
Solution Approach 1:
The wiring substrate is designed with a first electrode divided into multiple portions that can be selectively coupled to different wirings. This universal design allows a single wiring substrate to support multiple circuit configurations by changing which divided portion is coupled with the solder, eliminating the need to prepare multiple different substrate combinations for different circuit types.
3Adaptability or versatility
If circuits are switched by changing chips for each use, then adaptability is improved, but manufacturing cost and time increase
Solution Approach 1:
The electrode connection configuration is made dynamic through the divided portions that can be selectively coupled to different wirings. Instead of statically changing chips to switch circuits, the system allows dynamic reconfiguration by selecting which divided portion of the electrode is coupled with solder, enabling circuit switching without physical chip replacement and reducing time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient switching of electrode connections in semiconductor devices, reducing the need for multiple chip and substrate combinations and improving flexibility without altering existing circuit designs.
Implementation Method 1
at least one of the divided portions is coupled with the corresponding second electrode through a solder
Data Source
AI summary
Even in an electronic device where electrodes are coupled electrically using a solder, sections to which electrodes of an electronic component are coupled are switched by a method other than changing circuits of the electronic component or changing circuits of a wiring substrate.The electronic device includes: a wiring substrate having two or more first electrodes over one surface thereof; and an electronic component having, over one surface thereof, two or more second electrodes arranged corresponding to the two or more first electrodes, respectively. At least one of the first electrodes is a specific electrode divided into two or more divided portions, and the divided portions are coupled to different wirings, respectively. Further, at least one of the divided portions is coupled to a corresponding second electrode through a solder.