Interpenetrating Polymer Chip Carrier Bonding
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Solution Overview
Problem
Existing methods for attaching a chip to a chip carrier lack reliability and stability, particularly when adhesives are used, as they fail to maintain a stable connection between the chip and the chip carrier.
Innovation Solution
A method involving the formation of interpenetrating or inter-diffusing polymer structures by applying a first polymer layer over a metal surface and a second polymer layer over a carrier, followed by physical contact to create a stable connection, utilizing deposition techniques and controlled pressure and temperature to achieve a cohesive bond.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesives (pastes or glues) are used to connect chip to chip carrier, then the connection is initially formed, but the connection stability deteriorates over time and under thermal stress
Solution Approach 1:
The patent introduces polymer layers as intermediary materials between the chip and chip carrier. These polymer layers form interpenetrating structures that act as a mediating interface, replacing traditional adhesives and providing superior long-term stability and durability under thermal and mechanical stress.
Solution Approach 2:
The invention creates a composite structure consisting of multiple polymer layers with different properties. The first polymer layer is formed over the chip surface and the second polymer layer is formed over the chip carrier surface, creating a composite adhesive system that combines the advantages of different polymer materials for enhanced reliability.
2Reliability
If conventional adhesion processes are used, then the bonding process is simple, but the required temperature is high and connection reliability is poor
Solution Approach 1:
The patent changes the chemical and physical parameters of the bonding interface by using polymer layers with specific molecular structures. This allows the bonding process to occur at lower temperatures compared to conventional adhesion processes, while simultaneously improving connection reliability through the formation of interpenetrating polymer structures.
Solution Approach 2:
The invention utilizes phase transitions of polymer materials during the bonding process. The polymer layers undergo transitions between different physical states (e.g., glass transition, melting) that facilitate bonding at lower temperatures while maintaining high connection reliability after cooling and stabilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a stable and reliable connection between the chip and the chip carrier, reducing the risk of delamination and operating effectively at lower temperatures than conventional adhesion processes, ensuring high-performance semiconductor packaging.
Implementation Method 1
bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer
Data Source
AI summary
A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.