Embedded Component Board via Partitioned Cavity and Adhesive Mounting
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Solution Overview
Problem
The existing manufacturing method for electronic component-embedded boards is complex and costly due to the use of temporary fixation tapes, leading to uneven resin coverage, recesses in insulating layers, and unreliable via connections, especially when capacitors with varying thicknesses are mounted.
Innovation Solution
The method involves forming a core substrate with a component mounting pattern that partitions the cavity into through holes, allowing for simultaneous bonding and sealing of electronic components without temporary tapes, ensuring uniform resin coverage and consistent via hole depths through the use of adhesive agents and laser machining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a temporary fixation tape is used to mount the capacitor, then the capacitor can be securely positioned during manufacturing, but the manufacturing process becomes complicated and costly with multiple sealing steps
Solution Approach 1:
The patent removes the temporary fixation tape from the manufacturing process entirely. Instead, the capacitor is directly mounted on the component mounting pattern formed on the core substrate. This extraction of the unnecessary temporary tape eliminates the need for multiple sealing operations while maintaining secure capacitor positioning through the adhesive component mounting pattern.
Solution Approach 2:
The component mounting pattern serves multiple functions: it provides mechanical support for the capacitor, ensures precise positioning, and eliminates the need for separate temporary fixation elements. This multi-functional design integrates what were previously separate functions (positioning and mounting) into a single unified structure.
2Reliability
If resin is applied to seal the capacitor, then the capacitor is protected and insulated, but the resin flows into the space beside the capacitor reducing the volume available to cover the capacitor face
Solution Approach 1:
The patent applies a thickness adjustment layer beneath the capacitor before applying the sealing resin. This preliminary action compensates for the capacitor's thickness variation, creating a flat mounting surface that prevents resin from flowing into the space beside the capacitor. As a result, sufficient resin volume remains to completely cover the capacitor face and form a uniform first insulating layer.
3Volume of moving object
If the capacitor thickness is less than the core substrate thickness, then the capacitor can be embedded in the cavity, but the capacitor positions deviate to the upper portion causing uneven insulating layer thickness
Solution Approach 1:
The patent applies a thickness adjustment layer beneath the capacitor to compensate for the thickness difference between the capacitor and core substrate. This preliminary action raises the capacitor to the appropriate height position, ensuring that the upper and lower insulating layers formed by resin application have uniform thickness. This eliminates the deviation to the upper portion and achieves consistent via hole depths.
4Reliability
If via holes are formed to connect wiring layers to the capacitor, then electrical connection is established, but varying insulating layer thickness causes inconsistent via hole depths reducing connection reliability
Solution Approach 1:
The thickness adjustment layer is applied beforehand to create a uniform mounting surface for the capacitor. This preliminary height compensation ensures that when insulating layers are formed by resin application, they have consistent thickness throughout. Consequently, via holes formed through these uniform insulating layers achieve consistent depths, establishing reliable electrical connections between the wiring layers and capacitor.
Data Source
AI summary
An electronic component-embedded board includes: a core substrate; a cavity which penetrates the core substrate; a wiring layer formed on one face of the core substrate; a component mounting pattern formed of the same material as the wiring layer and laid across the cavity to partition the cavity into through holes in plan view; an electronic component mounted on the component mounting pattern and arranged inside the cavity; a first insulating layer formed on the one face of the core substrate to cover one face of the electronic component; and a second insulating layer formed on the other face of the core substrate to cover the other face of the electronic component. The cavity is filled with the first insulating layer and the second insulating layer.