Fan Out Build Up Substrate Stackable Package
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Solution Overview
Problem
Stacking electronic component packages increases undesirable thickness, making it challenging to minimize the size of electronic devices like cell phones, as traditional side-by-side arrangements are not efficient in reducing mounting area effectively.
Innovation Solution
The fan out build up substrate stackable package design involves a package body enclosing an electronic component with a buildup dielectric layer and circuit pattern, featuring via capture pads and apertures that allow direct connection to the metal layer, enabling extremely thin stacked assemblies by minimizing overall thickness through grinding and dielectric layer application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If electronic component packages are stacked one upon another, then the mounting area required is reduced, but the thickness of the package increases
Solution Approach 1:
The patent transitions from traditional side-by-side mounting in the planar dimension to vertical stacking in the thickness dimension. By creating a substrate stackable package with coplanar surfaces and integrated circuit patterns, the design enables packages to be stacked vertically while maintaining a minimized thickness profile, effectively moving the mounting solution to another spatial dimension.
2Length of stationary object
If the thickness of electronic component packages is minimized, then the size of electronic devices is reduced, but the mounting area efficiency decreases
Solution Approach 1:
The patent embeds the electronic component within a package body that encloses it, creating a nested structure. The circuit pattern is formed within the buildup dielectric layer that is applied to both the active surface of the electronic component and the first surface of the package body. This nesting allows the package to maintain extreme thinness while integrating all necessary functional elements, thereby reducing overall device size without sacrificing mounting efficiency.
3Reliability
If direct connection to the metal layer is facilitated, then the circuit connectivity is improved, but the manufacturing complexity increases
Solution Approach 1:
The patent forms via capture pad apertures that extend through the package body and expose the via capture pads on the circuit pattern before final assembly. This preliminary preparation of connection pathways simplifies subsequent manufacturing steps by pre-establishing the exact locations where vertical vias need to be formed, thereby facilitating direct connection to the metal layer while actually reducing overall manufacturing complexity.
Data Source
AI summary
A fan out build up substrate stackable package includes an electronic component having an active surface including a bond pad. A package body encloses the electronic component, the package body having a first surface coplanar with the active surface of the electronic component. A buildup dielectric layer is applied to the active surface of the electronic component and the first surface of the package body. A circuit pattern is formed within the first buildup dielectric layer and electrically connected to the bond pad, the first circuit pattern including via capture pads. Via capture pad apertures extend through the package body and expose the via capture pads. In this manner, direct connection to the first circuit pattern, i.e., the first metal layer, of the fan out build up substrate stackable package is facilitated. Further, the fan out build up substrate stackable package is extremely thin resulting in extremely thin stacked assemblies.