Multilayer PCB Radial Internal Heat Transfer
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Solution Overview
Problem
Conventional multilayer printed circuit boards face challenges in efficiently releasing heat generated by electronic components due to low thermal conductivity of insulating substrates, which limits heat transfer performance between surface and internal layer heat-transfer conductors, and increasing the electrode area to improve this performance results in increased costs and reduced component mounting capacity.
Innovation Solution
A multilayer printed circuit board design incorporating an insulating substrate with circuit layers, an electronic component, an electrode, an internal layer conductor, a heat releasing conductor, and connection vias arranged in a radial manner to disperse heat uniformly, allowing for improved heat release without expanding the electrode area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the area of the surface heat-transfer conductor is increased to improve heat transfer performance, then the heat transfer performance improves, but the number of components mounted on the multilayer printed circuit board decreases, the dimension of the multilayer printed circuit board increases, and the cost increases
Solution Approach 1:
The patent transitions from two-dimensional heat transfer (surface to surface through insulating substrate) to three-dimensional heat transfer by introducing internal layer heat-transfer conductors within the substrate. This allows heat to be transferred through multiple layers simultaneously, increasing the effective heat transfer area without expanding the surface footprint of the electrode.
Solution Approach 2:
The patent embeds internal layer heat-transfer conductors within the insulating substrate layers, nesting multiple conductor layers at different depths. This creates a multi-layer heat transfer system where heat can be conducted through multiple nested conductor planes, effectively increasing heat transfer capacity without increasing the external electrode area.
2Loss of energy
If the area of the surface heat-transfer conductor is increased to improve heat transfer performance, then the heat transfer performance improves, but the dimension of the multilayer printed circuit board increases
Solution Approach 1:
The solution moves heat transfer from the surface plane into the vertical dimension by creating internal conductor layers at different depths within the substrate. This allows the heat transfer area to expand in the Z-direction (thickness direction) rather than requiring expansion in the X-Y plane, thus improving heat transfer without increasing board dimensions.
Solution Approach 2:
The patent creates a composite structure combining insulating substrate material with embedded conductive layers. This composite approach allows the heat transfer conductors to be integrated within the substrate itself, eliminating the need for separate surface-mounted heat transfer components that would increase board area.
3Loss of energy
If the area of the surface heat-transfer conductor is increased to improve heat transfer performance, then the heat transfer performance improves, but the cost increases
Solution Approach 1:
The patent merges the heat transfer function with the existing multi-layer substrate structure by integrating heat-transfer conductors into the internal layers. This combines multiple functions (structural support, electrical insulation, and heat transfer) into a single integrated system, eliminating the need for separate surface-mounted heat transfer components and reducing overall manufacturing cost.
Solution Approach 2:
The internal layer heat-transfer conductors serve multiple functions: they provide thermal conduction pathways, maintain electrical insulation between layers, and contribute to the mechanical structure of the board. This multi-functionality reduces the need for additional dedicated heat transfer components, thereby reducing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat release performance by increasing the heat capacity and surface area of conductors coupled with electronic components, efficiently transferring heat to the insulating substrate while maintaining a compact electrode size, enabling the mounting of components like transistors without increasing the electrode area.
Implementation Method 1
heat generated from an electronic component is transferred from the surface heat-transfer conductor to the internal layer heat-transfer conductor through an insulating substrate
Data Source
AI summary
A multilayer printed circuit board includes an insulating substrate, circuit layers arranged in the insulating substrate, an electronic component, an electrode disposed on the circuit layer exposed from a surface of the insulating substrate and including a soldered portion at which a terminal of the electronic component is soldered, an internal layer conductor disposed on the circuit layer located inside the insulating substrate and defining through holes in a radial manner centering on the soldered portion, a heat releasing conductor disposed on the circuit layer next to the circuit layer on which the internal layer conductor is disposed, and connection vias inserted in the through holes and coupling the electrode and the heat releasing conductor so as to enable a heat transfer between the electrode and the heat releasing conductor. The internal layer conductor and the heat releasing conductor overlap a whole area of the soldered portion.