Wiring Board Insulating Layer Boundary Design
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Solution Overview
Problem
Existing wiring board fabrication methods face challenges in ensuring reliable electrical connections and efficient material usage, particularly in covering boundary portions between insulating and wiring sub boards without the need for additional adhesives or bridges.
Innovation Solution
A wiring board design featuring an insulating layer with via holes filled with conductors, formed by plating, that extends continuously from the insulating board to the wiring sub board, eliminating the need for bridges and adhesives by using a low-flow resin to secure the sub boards in place.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional adhesives or bridges are used to secure wiring sub boards to the insulating board, then the reliability of electrical connections is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The insulating layer is merged with the boundary portion filling function, creating a continuous insulating structure that simultaneously provides electrical insulation and mechanical securing. The insulating layer extends continuously from the insulating board to the wiring sub board, eliminating the need for separate adhesives or bridges while maintaining connection reliability and reducing structural complexity.
2Strength
If additional adhesives or bridges are used to secure wiring sub boards, then the mechanical strength is improved, but the manufacturing cost and material usage increase
Solution Approach 1:
The insulating layer serves dual functions as both electrical insulator and mechanical securing element. By filling the boundary portion between the insulating board and wiring sub board with the same insulating material, the patent eliminates the need for additional adhesives or bridges, thereby reducing material usage while maintaining sufficient mechanical strength through the continuous insulating structure.
3Reliability
If bridges or adhesives are used to cover boundary portions, then the electrical insulation is improved, but the fabrication process becomes more complex and costly
Solution Approach 1:
The insulating layer is formed to continuously extend from the insulating board to the wiring sub board, merging the electrical insulation function with the boundary coverage function. This continuous insulating structure provides reliable electrical insulation while simplifying the fabrication process by eliminating separate steps for applying adhesives or bridges, thereby reducing manufacturing complexity and cost.
4Manufacturing precision
If a continuous insulating layer is formed from the insulating board to the wiring sub board, then the manufacturing precision is improved, but the material consumption increases
Solution Approach 1:
The insulating layer is formed to continuously extend from the insulating board to the wiring sub board, providing high-precision alignment and secure positioning. While this continuous structure does consume more insulating material compared to discrete adhesives, the patent optimizes material usage by forming the insulating layer as an integrated structure that serves multiple functions simultaneously, achieving a balance between manufacturing precision and material consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-precision alignment and secure electrical connections between sub boards without additional materials, reducing fabrication costs and improving yield by eliminating defective boards at an early stage.
Implementation Method 1
an insulating layer having a via hole in which a conductor to be electrically connected to the conductive pattern is formed by plating, the insulating layer continuously extending from the insulating board to the wiring sub board so as to cover a boundary portion between the insulating board and the wiring sub board
Implementation Method 2
a conductor to be electrically connected to the conductive pattern is formed by plating
Data Source
AI summary
A wiring board includes an insulating board, a wiring sub board having a wiring layer, and an insulating layer. The insulating layer has a via hole in which a conductor is formed by plating. The insulating board and the wiring sub board are horizontally laid out. The insulating layer is laid out to cover a boundary portion between the insulating board and the wiring sub board and continuously extends from the insulating board to the wiring sub board. A resin which constitutes the insulating layer is filled in the boundary portion. The conductor is electrically connected to the wiring layer.