Layout Circuit with Diagonal Grid Arrays for Signal Noise Reduction
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Solution Overview
Problem
The increasing complexity of integrated circuit devices requires more interconnections, which can lead to performance limitations due to signal noise and increased manufacturing costs, especially as chip packaging impacts both performance and cost, and additional signal layers on printed circuit boards can introduce defects.
Innovation Solution
A layout circuit design utilizing 3×2 grid arrays with diagonally arranged signal and fixed potential contact points, allowing for efficient signal transmission and reduced noise interference, while minimizing the need for additional signal layers by using a 2×2 array configuration and shared circuit lines for power Vdd and Vss or ground.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If extra signal layers are added to provide more signal paths, then the number of signal paths increases, but manufacturing cost increases and defect occurrence increases
Solution Approach 1:
The patent combines signal transmission and power delivery functions into the same physical layer structure. The 3×2 grid array uses shared circuit lines that simultaneously carry signals and provide power (Vdd/Vss) through diagonal arrangements, eliminating the need for separate dedicated power layers and reducing total layer count while maintaining signal path quantity.
Solution Approach 2:
The circuit lines in the grid array are designed to serve multiple functions: signal transmission, power delivery, and noise shielding. The same physical infrastructure supports multiple operational roles, allowing the system to provide more signal paths without proportionally increasing manufacturing complexity or defect risk associated with adding separate layers.
2Adaptability or versatility
If more interconnections are added to complex integrated circuit devices, then device functionality increases, but signal noise increases and performance is limited
Solution Approach 1:
The patent introduces fixed potential contact points (Vdd/Vss) as intermediary elements within the grid array structure. These fixed potential points act as noise shields and reference planes between signal contact points, mediating the electromagnetic environment to reduce crosstalk and signal noise while allowing increased interconnection density for enhanced device functionality.
Solution Approach 2:
The diagonal arrangement of fixed potential contact points creates equipotential regions within the grid array. By positioning Vdd and Vss contact points at specific diagonal locations, the patent establishes stable reference potential zones that minimize voltage fluctuations and noise coupling between adjacent signal lines, enabling higher interconnection counts without proportional noise increase.
3Reliability
If chip packaging is optimized for performance, then signal transmission quality improves, but cost increases
Solution Approach 1:
The patent segments the chip package into modular 3×2 grid array units that can be independently designed and manufactured. Each grid array module contains optimized signal and power contact point arrangements that can be replicated across the substrate, allowing performance optimization at the module level while maintaining cost efficiency through standardization and economies of scale in manufacturing.
Data Source
AI summary
The layout circuit comprises a first 3×2 grid array and a second 3×2 grid array. The first 3×2 grid array comprises first, second and third signal contact points and the first and second fixed potential contact points are coupled to a first fixed potential. The first and second fixed potential contact points are arranged diagonally into the first 2×2 array and the first and second signal contact points are also arranged diagonally into the first 2×2 array. The second 3×2 grid array comprises fourth, fifth and sixth signal contact points and the third and fourth fixed potential contact points are coupled to the first fixed potential. The third and fourth fixed potential contact points are arranged diagonally into the second 2×2 array and the fourth and fifth signal contact points are also arranged diagonally into the second 2×2 array.