Composite Electronics Chassis with Embedded Thermal Pathways
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Solution Overview
Problem
Conventional electronics chassis made entirely of high thermal conductivity metals are often too heavy and fail to effectively manage electromagnetic interference (EMI) while efficiently cooling circuit card assemblies in harsh environments with extreme temperature gradients and high shock/vibration.
Innovation Solution
A lightweight composite-paneled chassis with embedded thermal pathways, including sealed two-phase capillary heat pipes, that conductively cool circuit card assemblies and reduce EMI by incorporating EMI-reducing materials and structures, such as metallic inserts and Faraday cage coatings, while maintaining mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the chassis is made entirely of high thermal conductivity metal, then heat transfer capability is improved, but weight increases
Solution Approach 1:
The patent applies composite materials by integrating thermally conductive pathways (such as metal traces, heat pipes, or phase change materials) into a non-metallic chassis structure. This allows the chassis to achieve adequate heat transfer capability without requiring complete metal construction, thereby reducing overall weight while maintaining thermal management performance.
Solution Approach 2:
The chassis is segmented into different material zones: non-metallic structural panels for weight reduction and localized thermally conductive pathways for heat transfer. This segmentation allows each region to perform its specific function optimally - the non-metallic portions provide structural support with reduced weight, while the conductive pathways efficiently remove heat from critical components.
2Strength
If the chassis is made entirely of metal, then mechanical support is improved, but weight increases
Solution Approach 1:
The patent employs composite materials where non-metallic structural panels provide the primary chassis framework and mechanical support, supplemented by embedded conductive pathways. This composite approach maintains adequate structural strength while significantly reducing weight compared to solid metal construction.
Solution Approach 2:
The structural support function is segmented from the thermal management function. The non-metallic panels provide mechanical support, while separate conductive pathways (metal traces, heat pipes, or phase change material layers) handle heat transfer. This functional segmentation allows optimization of each aspect independently.
3Object-affected harmful factors
If EMI shielding is enhanced, then electromagnetic interference protection is improved, but device complexity increases
Solution Approach 1:
The conductive pathways serve multiple functions simultaneously: they provide thermal conduction for heat removal and electrical continuity for EMI shielding. By integrating these two functions into a single structural element, the patent reduces overall device complexity while achieving both effective thermal management and electromagnetic interference protection.
Solution Approach 2:
The patent merges the thermal management system and EMI shielding system into a unified structure. The same conductive pathways (metal traces, heat pipes, or phase change material networks) that remove heat also provide electrical connectivity for shielding against electromagnetic interference, eliminating the need for separate shielding components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a lightweight chassis with enhanced heat removal capabilities, reduced thermal resistance, and improved EMI shielding, enabling increased processor power capacity and effective operation in extreme environments.
Implementation Method 1
a conductive thermal pathway extending through said panel from said internal face of said composite segment to said external face of said composite segment
Implementation Method 2
The thermal pathway is one of a sealed, two-phase, capillary heat pipe, an oscillating heat pipe, a vapor chamber, and a thermosiphon
Implementation Method 3
The thermal pathway is one of a sealed, two-phase, capillary heat pipe
Implementation Method 4
reduce EMI by incorporating EMI-reducing materials and structures, such as metallic inserts and Faraday cage coatings
Implementation Method 5
improved EMI shielding
Data Source
AI summary
An electronics chassis (100) is provided. The electronics chassis includes a plurality of panels (104, 106, 108, 110, 112) that define an interior space (102). One panel of the plurality of panels has a composite segment (122) having an internal face (126) and an external face (124). The electronics chassis further includes a conductive thermal pathway (132) that extends through the panel from the internal face of the composite segment to the external face of the composite segment.