Embedded thermal pathways in a lightweight composite chassis remove heat from circuit cards while providing EMI shielding without increasing weight.
Selective embossing maintains planarity and strength while accommodating capillary channels to reduce manufacturing costs.
Phase transitions within a compact heat pipe remove heat from the torch head, maintaining operable temperatures without increasing device size.
A multi-functional electrolyte cools lithium-ion batteries through internal phase change evaporation and condensation cycles.
A resilient clamp presses a heat pipe against a transceiver to conduct operational heat to a base, preventing overheating and ensuring reliability.
Warped metal layers in a loop heat pipe increase conduit height, reducing fluid resistance and improving thermal transport efficiency.
A control unit evaluates lifting force in vertical two-phase flow heat exchangers by adjusting gas phase composition.
A vapor chamber wick sheet uses branched liquid channels to distribute working fluid across a wide area.
A heat exchanger fluid circuit uses a gravity-fed duct to return working fluid between chambers for efficient thermal exchange.
A heat sink uses a flat segment on the heat pipe to directly contact the heat-generating element for efficient thermal transfer.
A unitary graphene-based heat sink dissipates thermal energy through integral fins.
A copper sheet heat dissipation device uses micro-fins inside sealed cavities to move thermal energy via working fluid phase transitions.
Embedded heat pipes in a distributor plate transfer heat to a rear sink, preserving chassis slot space.
Oblique locking lugs allow pin movement during impact and facilitate reset, eliminating individual calibration for different vehicle thresholds.
A radiator cleaning device applies foam via an upper frame and extracts fluid through a lower suction unit.
A heat sink uses a vapor chamber with a protruding portion to transfer heat from electronic components to radiating fins.
Segmenting hydraulic circuits with a heat exchanger prevents header fluid overheating while maintaining operational efficiency.
A flexible heat pipe uses a bellows structure to reduce force reaction below 2.5 N while maintaining thermal performance.
Resin-polyolefin composition disperses asphaltenes to prevent coking deposits that reduce heat transfer efficiency.
A heat pipe uses segmented porous structures with varying pore sizes to drive liquid flow via capillary action.
Segmenting heat pipes radially around a central cooling chamber reduces volume occupancy while maintaining design flexibility for dense electronics.
A heat transfer device moves thermal energy via pressure-driven fluid flow, eliminating porous wicks and forced pumping mechanisms.
An ammonia-compatible barrier wall resolves thermal expansion and chemical compatibility contradictions in high-energy laser evaporators.
Segmented liquid loops cool sensitive and robust components separately, preventing overheating when airflow is limited.
A fluid injection system charges phase-change thermal devices with precise working fluid volumes.
Longitudinal ridges segment the wick to create separate vapor cavities, maintaining heat transfer capacity within slim profiles.
A hybrid two-phase cooling device uses a non-permeable barrier to separate vapor and liquid phases within an enclosure.
A heat pipe uses a non-condensable gas plug to control fluid reservoir access without mechanical parts.
A heat dissipater combines a capillary heat pipe and spreader to allow working fluid flow between components.