Distributor Plate Thermal Management for Slot Space
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Solution Overview
Problem
The challenge in cooling electronic devices is the excessive heat generation, particularly in compact spaces, where tall heat sinks occupy adjacent slots in a chassis, reducing the number of available slots for other components.
Innovation Solution
A thermal management system utilizing a distributor plate that secures over a circuit board, with a minimal footprint, and incorporates heat pipes and a rear heat sink to efficiently dissipate heat from high-power modules like the 100 G Long Haul MSA module, without extending outwardly, thus preserving slot space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a tall heat sink is used to cool the 100 GLH MSA module, then heat dissipation is improved, but the number of available slots in the chassis is reduced
Solution Approach 1:
The patent redirects heat dissipation from a vertical dimension (tall heat sink extending outward) to a horizontal dimension (rear heat sink on the opposite side of the circuit board). This allows heat to be dissipated effectively while maintaining a low profile that fits within the slot boundaries, thus resolving the contradiction between heat dissipation performance and slot space occupation.
Solution Approach 2:
The thermal management system is segmented into multiple components: a minimal footprint heat sink at the front and a rear heat sink on the opposite side of the circuit board. This segmentation allows heat to be dissipated from multiple locations, improving overall heat dissipation performance without requiring a single tall heat sink that would occupy adjacent slots.
2Area of stationary object
If a minimal footprint distributor plate is used, then slot space is preserved, but heat dissipation capability must be maintained
Solution Approach 1:
The distributor plate merges multiple functions into a single component: it serves as both a structural support element and a thermal management component. By integrating the heat pipe attachments and rear heat sink directly to the distributor plate, the system achieves effective heat dissipation from a compact footprint, resolving the contradiction between minimal area and heat dissipation capability.
Solution Approach 2:
The distributor plate acts as an intermediary between the high-power module and the rear heat sink. It provides a thermal interface that efficiently transfers heat from the module to the heat pipes and rear heat sink, enabling effective heat dissipation from a compact footprint without requiring the distributor plate itself to be large.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat from high-power components without occupying additional slots, allowing for increased density of electronic devices within a chassis while maintaining effective cooling.
Implementation Method 1
incorporates heat pipes and a rear heat sink to efficiently dissipate heat
Implementation Method 2
incorporates heat pipes and a rear heat sink to efficiently dissipate heat from high-power modules
Data Source
AI summary
A thermal management system includes a distributor plate secured to and parallel to a circuit board. The circuit board has a module secured thereto and the distributor plate defines an area on an inner surface thereof secured to or otherwise in thermal contact with the module. Heat pipes embedded in the distributor plate include a portion over the module and a portion over the circuit board outward from the module. A portion of the heat pipes outward from the module may be substantially perpendicular to a direction of airflow between the circuit board and distributor plate. The module may be located closer to one edge of the circuit board and the heat pipes may according extend from adjacent that edge to an opposite edge of the circuit board. An inward facing surface may include fins extending toward the circuit board and the fins may be contoured to the circuit board.