Heat Dissipation Structure With Resilient Clamp And Heat Pipe
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Solution Overview
Problem
Transceivers in optical communication systems generate significant heat, leading to performance and reliability issues due to inefficient heat dissipation, which can result in overheating and damage if not properly managed.
Innovation Solution
A heat dissipation structure featuring a heat dissipation base with through holes and heat conduction assemblies, each comprising a resilient clamp and a heat pipe, where the heat pipe's conducting sections are positioned to efficiently transfer heat from the transceiver to the base for effective dissipation, utilizing materials with good thermal conductivity like aluminum alloy or copper.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat dissipation methods are used, then the structure is simple, but heat dissipation efficiency is insufficient leading to overheating
Solution Approach 1:
The patent introduces a heat pipe as an intermediary component between the transceiver and the heat dissipation base. The heat pipe efficiently transfers heat from the transceiver to the base, significantly improving heat dissipation efficiency without requiring complex active cooling systems. This mediator component solves the contradiction by providing high-efficiency heat transfer through a relatively simple passive structure.
2Loss of energy
If heat dissipation base area is increased, then heat dissipation efficiency improves, but device size increases
Solution Approach 1:
The patent divides the heat dissipation function into two separate components: the heat pipe for heat transfer and the heat dissipation base for heat dissipation. This segmentation allows the heat dissipation base to be optimized independently for thermal conduction properties rather than being constrained by the overall device size. The heat pipe acts as a bridge that efficiently connects the compact transceiver to the heat dissipation base, enabling effective heat dissipation without requiring a large integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures quick and efficient heat dissipation, preventing temperature increases in transceivers and maintaining their performance and reliability during operation by effectively transferring heat generated during operation to the heat dissipation base.
Implementation Method 1
heat that is generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base
Implementation Method 2
the two resilient pressing plates of the resilient clamp push the two heat conducting sections of the heat pipe respectively
Data Source
AI summary
A heat dissipation structure has a heat dissipation base and at least one heat conduction assembly mounted in a through hole of the heat dissipation base. Each of the at least one heat conduction assembly includes a resilient clamp and a heat pipe. When a transceiver is inserted in the through hole of the heat dissipation base, two heat conducting sections of the heat pipe are pushed by the resilient clamp to abut against the transceiver and the heat dissipation base respectively. Heat generated while the transceiver is operating can be quickly and efficiently conducted through the heat pipe to the heat dissipation base and then dissipated. Temperature increase of the transceiver can be effectively avoided and performance and reliability of the transceiver during operation can be ensured.