Raised Bodied Vapor Chamber Structural Support
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Solution Overview
Problem
Conventional vapor chambers face challenges in maintaining planarity and strength due to miniaturization, leading to inefficient heat dissipation and high manufacturing costs, as capillary structures required for improved backflow efficiency cannot be integrated without compromising thickness.
Innovation Solution
A raised bodied vapor chamber structure with a main body featuring a condensation section, evaporation section, and a chamber, where a raised section is selectively formed on either section to enhance support and accommodate capillary structures, reducing manufacturing costs through embossing or recess formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If capillary structures (such as copper posts, sintered posts, or foamed posts) are disposed in the vapor chamber as support structures, then the backflow efficiency is improved, but the vapor chamber thickness cannot be reduced below 1.5 mm and the planarity and strength are compromised
Solution Approach 1:
The patent transitions from vertical capillary structures (posts extending through the chamber thickness) to horizontal capillary channels (etched grooves on the chamber bottom). This dimensional change allows capillary action to occur within the available thickness without requiring excessive thickness to accommodate vertical post structures, thereby enabling thinner chamber designs while maintaining backflow efficiency.
Solution Approach 2:
The patent extracts the capillary structure from the traditional vertical post configuration and relocates it to the horizontal channel system etched into the chamber bottom. This extraction removes the need for thick chamber walls to accommodate vertical posts, allowing the chamber thickness to be reduced while preserving the essential capillary backflow function.
2Productivity
If capillary structures are added to enhance backflow efficiency, then the backflow speed is improved, but the manufacturing cost increases and the vapor chamber cannot be thinned
Solution Approach 1:
The patent replaces complex mechanical capillary structures (posts, sintered bodies, mesh bodies) with a simpler etched channel system. The capillary action is achieved through etched grooves on the chamber bottom rather than through complex three-dimensional post structures, significantly simplifying the manufacturing process and reducing costs while maintaining backflow efficiency.
Solution Approach 2:
The patent changes the geometric parameters of the capillary structure from vertical posts requiring thick walls to horizontal etched channels. This parameter change allows the same capillary backflow function to be achieved with thinner chamber walls and simpler manufacturing processes, thereby reducing manufacturing costs while maintaining or improving backflow efficiency.
3Length of stationary object
If the vapor chamber is thinned to reduce size, then the electronic apparatus can be made thinner, but the planarity and strength of the vapor chamber cannot be maintained
Solution Approach 1:
The patent segments the chamber bottom into multiple regions with etched channels of varying depths and patterns. This segmentation creates a reinforced grid-like structure that provides structural support and maintains planarity even when the overall chamber thickness is reduced, preventing collapse while enabling thinning.
Solution Approach 2:
The patent employs composite structural design by combining the chamber walls with etched channel networks on the bottom surface. This composite approach creates a reinforced structure where the etched channels provide both the capillary function and additional structural support, allowing the chamber to be thinned while maintaining strength and planarity.
4Ease of manufacture
If conventional etching or formed channels are used to create capillary structures, then the manufacturing process is simple, but the etching precision is poor and processing time is long
Solution Approach 1:
The patent applies different etching depths and channel patterns to different regions of the chamber bottom. The etched channels are strategically positioned and dimensioned to provide optimal capillary action while requiring controlled precision only where needed. This localized approach to etching precision allows for simpler manufacturing processes while achieving the desired functional results.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The raised bodied vapor chamber structure effectively maintains planarity and strength while enhancing backflow efficiency and reducing manufacturing costs, addressing the limitations of conventional thin vapor chambers.
Implementation Method 1
The raised section is selectively formed on the evaporation section or the condensation section and protrudes from the evaporation section or the condensation section
Implementation Method 2
The working fluid of the vapor chamber is heated and evaporated in the evaporation section from a liquid phase into a vapor phase
Implementation Method 3
After the vapor working fluid reaches the condensation section of the vapor chamber, the vapor working fluid is condensed from the vapor phase into the liquid phase
Implementation Method 4
the liquid working fluid then flows back to the evaporation section for next circulation
Data Source
AI summary
A raised bodied vapor chamber structure is disclosed and includes a main body and a working fluid. The main body has a condensation section and an evaporation section and a chamber. The condensation section and the evaporation section are respectively disposed on two sides of the chamber. The evaporation section has a first face and a second face. A raised section is formed on the first face. The working fluid is filled in the chamber. The raised section is formed by means of mechanical processing as a support structure for enhancing the structural strength of the vapor chamber structure. The vapor chamber structure is manufactured at a much lower cost.