Composite CMP Pad for Heat-Conductive Wafer Polishing

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Solution Overview

Problem

Existing chemical mechanical polishing (CMP) systems face limitations in heat management, leading to temperature-related failures and reduced removal rates due to the low thermal conductivity of traditional polishing pads, such as polyurethane, which restricts the application of higher downforces and platen speeds.

Innovation Solution

Incorporating a composite polishing pad composed of a first material suitable for polishing, such as polyurethane, and a second material with high thermal conductivity, like vapor grown carbon nano fibers (CNF), to enhance the heat transfer coefficient (HTC) and reduce temperature differentials across the pad.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional polishing pad materials (e.g., polyurethane) are used, then polishing functionality is maintained, but thermal conductivity is low leading to poor heat management

Engineering Contradiction:

Improvepolishing pad temperatureVSAvoidremoval rate

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The polishing pad is constructed as a composite material system combining polyurethane base material with thermally conductive fillers (graphite, graphene, or metal particles). This composite structure maintains the polishing functionality of the polyurethane while introducing high thermal conductivity pathways through the filler materials, enabling effective heat removal and allowing higher downforces and platen speeds to be applied during polishing operations

Inventive Principle:

Principle #40Composite materials

2Productivity

If higher downforces and platen speeds are applied to increase removal rates, then productivity improves, but heat generation increases causing temperature-related failures

Engineering Contradiction:

Improveremoval rateVSAvoidtemperature-related failures

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The invention converts the harmful heat generated during high-productivity polishing into a manageable thermal flow by utilizing the thermally conductive filler materials to channel and remove the heat. The friction and pressure that generate heat are transformed into controlled thermal conduction through the graphite, graphene, or metal particle network, allowing high removal rates to be sustained without temperature-related failures

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composite pad effectively manages heat, allowing for higher downforces, increased removal rates, and improved productivity by maintaining the polishing pad temperature below threshold levels, thereby enhancing CMP system performance.

Implementation Method 1

at least one second material configured to increase a heat transfer coefficient (HTC) of the polishing pad

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260070183A1Thermally conductive chemical mechanical polishing (CMP) pad

Publication Date: 2026.03.12 ASM AMERICA INC

AI summary

Thermally conductive chemical mechanical polishing (CMP) pads are disclosed. In one aspect, a polishing pad for a CMP system includes at least one first material having properties for polishing a wafer and at least one second material configured to increase a heat transfer coefficient (HTC) of the polishing pad.