Composite Heat Dissipation Mechanism for Multiple Heat Sources
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat dissipation mechanisms are ineffective for multiple heat sources in electronic devices, as they primarily rely on either air cooling or liquid cooling, which are limited in their ability to manage heat from multiple sources effectively.
Innovation Solution
A composite heat dissipation mechanism combining air-cooling and liquid-cooling assemblies, featuring airflow generators, heat dissipation fins, heat pipes, and fluid drivers to create a circulation flow path for cooling fluid, allowing simultaneous heat dissipation from multiple heat sources.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional air cooling or liquid cooling is used, then heat dissipation from a single heat source is effective, but heat dissipation from multiple heat sources remains insufficient
Solution Approach 1:
The patent combines air cooling and liquid cooling systems into a single integrated heat dissipation device. The air cooling portion uses fans and heat dissipation fins, while the liquid cooling portion uses water blocks and circulation pipes. Both systems work simultaneously to dissipate heat from multiple heat sources, resolving the limitation of conventional single-method cooling systems that could only effectively handle one heat source at a time
2Power
If a single cooling method (air or liquid) is used, then the system structure remains simple, but the cooling capacity for multiple heat sources is insufficient
Solution Approach 1:
The patent merges air cooling components (fans, heat dissipation fins) and liquid cooling components (water blocks, circulation pipes) into an integrated structure. The housing contains both cooling systems, with the liquid cooling water blocks positioned to contact multiple heat sources simultaneously, while air cooling components provide additional heat dissipation. This combination increases overall cooling capacity while maintaining a unified device structure
Solution Approach 2:
The heat dissipation device is designed to perform multiple cooling functions simultaneously. The liquid cooling system can cool multiple heat sources through circulation pipes that contact different heat-generating components, while the air cooling system provides supplementary heat dissipation. This multi-functional design allows a single device to handle various cooling scenarios without requiring separate cooling systems for each heat source
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by utilizing both air and liquid cooling methods synergistically, providing multiple cooling cycles and improved thermal management for electronic devices with multiple heat sources.
Implementation Method 1
The former utilizes a fan to blow air onto heat dissipation fins thermally coupled to a heat source, thereby dissipating the heat generated by the heat source
Implementation Method 2
The latter employs a circulating liquid cooling system composed of a water block, radiator, and pump, where a cooling fluid absorbs heat from the heat source via the water block
Implementation Method 3
The air-cooling heat dissipation assembly further includes a heat pipe, a first end of the heat pipe is thermally coupled to the first heat dissipation fin, and a second end of the heat pipe is thermally coupled to the heat sources
Data Source
AI summary
A composite heat dissipation mechanism is provided for dissipating heat from heat sources. The mechanism includes an air-cooling heat dissipation assembly and a liquid-cooling heat dissipation assembly. The air-cooling heat dissipation assembly includes an airflow generator with a first air outlet, and a first heat dissipation fin disposed adjacent to the first air outlet and thermally coupled to the heat sources. The liquid-cooling heat dissipation assembly includes a heat-conducting flow pipe thermally coupled to the first heat dissipation fin and configured to accommodate a cooling fluid, and a fluid driver in communication with the heat-conducting flow pipe to form a circulation flow path. The fluid driver is configured to drive the cooling fluid to circulate within the circulation flow path.